{"title":"Colamination technology for electronic packaging applications","authors":"S. Leach, C.N. Ernsberger","doi":"10.1109/ISAPM.1997.581250","DOIUrl":null,"url":null,"abstract":"\"Colamination\" is a packaging technology that, in many ways, is a cost effective organic version of Cofire ceramic. The Colamination process and material sets have been in development at CTS for several years. An extensive reliability database has been developed for Colaminated substrates through fabrication of various test vehicles and prototypes. Recent work by CTS involves qualification of Colaminated substrates in several customer applications. This abstract briefly describes Colamination technology and some prototype work CTS has been involved with. We also describe some recent technical developments in Colamination technology.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1997.581250","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
"Colamination" is a packaging technology that, in many ways, is a cost effective organic version of Cofire ceramic. The Colamination process and material sets have been in development at CTS for several years. An extensive reliability database has been developed for Colaminated substrates through fabrication of various test vehicles and prototypes. Recent work by CTS involves qualification of Colaminated substrates in several customer applications. This abstract briefly describes Colamination technology and some prototype work CTS has been involved with. We also describe some recent technical developments in Colamination technology.