Advanced encapsulant systems for flip chip

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581252

D. Gamota, C. Melton

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引用次数: 11

Abstract

Flip chip on board (FCOB) technology is a novel electronic assembly structure whereby a bare integrated circuit (IC) die is interconnected directly to an organic printed circuit board (PCB). Mechanical coupling of the die and PCB by an epoxy encapsulant enhances the performance of the FCOB assembly during reliability testing. Advanced encapsulant materials for FCOB must address the issues observed during assembly of consumer electronic products on a high volume manufacturing line. The development of these materials is critical to continue the integration of FCOB assemblies as an alternative packaging system in electronic products. Materials characterization studies were performed to determine the glass transition temperatures (Tg), tensile elastic and loss moduli (E' and E"), flow profiles, coefficients of thermal expansion (CTE), and apparent strengths of adhesion for several advanced encapsulants. In addition, reliability tests were conducted to observe the relationship between encapsulant materials properties and reliability responses.

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用于倒装芯片的先进封装系统

板上倒装芯片(FCOB)技术是一种新型的电子组装结构，将裸集成电路(IC)芯片直接连接到有机印刷电路板(PCB)上。在可靠性测试中，通过环氧密封剂将模具和PCB机械耦合，提高了FCOB组件的性能。用于FCOB的先进封装材料必须解决在大批量生产线上组装消费电子产品时观察到的问题。这些材料的发展对于FCOB组件作为电子产品的替代封装系统的持续集成至关重要。研究人员进行了材料表征研究，以确定几种高级密封剂的玻璃化转变温度(Tg)、拉伸弹性和损失模量(E'和E")、流动曲线、热膨胀系数(CTE)和表观粘附强度。此外，还进行了可靠性试验，观察了封装材料性能与可靠性响应的关系。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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