低成本焊料倒装芯片

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1900-01-01 DOI:10.1109/ISAPM.1997.581270

G. Rinne, P. Magill

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引用次数: 0

摘要

自20世纪60年代初IBM的固体逻辑技术(SLT)中出现倒装芯片封装技术以来，人们投入了大量的思想和精力来使倒装芯片在成本上与线键结合具有竞争力。虽然这一目标在过去几年中偶尔得以实现，但随着线键技术的不断进步，这一优势一再重新获得。

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Low cost solder flip chip

Since the advent of flip chip packaging technology in the solid logic technology (SLT) of IBM in the early 1960s, a great deal of thought and energy has been invested toward making flip chip cost competitive with wirebonding. While this goal has been occasionally met in the intervening years, the relentless progress of wirebond technology has repeatedly regained the advantage.

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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