Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces最新文献_第4页

Corrosion resistant wire for small diameter wire bonding applications 用于小直径焊丝粘接的耐腐蚀焊丝

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581267

M. Mckeown

{"title":"Corrosion resistant wire for small diameter wire bonding applications","authors":"M. Mckeown","doi":"10.1109/ISAPM.1997.581267","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581267","url":null,"abstract":"Wire bonding is now a major method of interconnection. Over the years, as electronic packages became more technologically advanced, the wire bonders and the wire had to mature at the same rate. Aluminum wire is one of the main components used in wire bonding these electronic devices. In some applications, this aluminum wire must be able to withstand harsh environments, such as salt spray and autoclave, within a temperature range from -40 to +125/spl deg/C. There was now a need for a wire that would be able to withstand this temperature range and withstand the harsh environment. Wire manufacturers responded by developing an anti-corrosion wire that would withstand the autoclave (pressure cooker) conditions. This aluminum based wire has been used in the larger diameter sizes (127 to 508 microns or 5 to 20 mils) for a few years already in mostly automotive applications. Recently many end-users have utilized this corrosion resistant wire in small diameter applications (50.8 and 76.2 microns or 2 and 3 mils). Most of these applications are also automotive related. Corrosion resistant wire is unique in that there are some essential dopants in the wire that prevent the wire from physical damage. This paper will discuss the composition of this type of wire and review findings from the autoclave test done on various wire types.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128801951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Microwave characterization of thin film materials for interconnections of advanced packaging 先进封装互连用薄膜材料的微波特性研究

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581278

B. Fléchet, R. Salik, J. W. Tao, G. Angénieux

引用次数: 5

Passive optical alignment methods 无源光学对准方法

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581290

R. Boudreau

引用次数: 4

An ovenview of SBU (Sequential Build-Up)/Microvia technologies? SBU(顺序积聚)/微孔技术概述?

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581245

I. Ho

引用次数: 6

Reduced cycle time epoxies for flip chip underfill 减少倒装芯片底填料环氧树脂的循环时间

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581256

M. Bonneau, J. Stewart

引用次数: 6

Microwave characterization of packaging materials 包装材料的微波特性

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581283

D. Amey, S. Horowitz

引用次数: 6

Microvia materials: enablers for high density interconnects 微孔材料:实现高密度互连

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581248

J. Paulus, M. Petti

引用次数: 10

High performance underfills for low-cost flip-chip applications 用于低成本倒装芯片应用的高性能填充物

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581251

S. Shi, G. Jefferson, C. Wong

{"title":"High performance underfills for low-cost flip-chip applications","authors":"S. Shi, G. Jefferson, C. Wong","doi":"10.1109/ISAPM.1997.581251","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581251","url":null,"abstract":"To develop the no-flow underfill materials suitable for no-flow underfill processing for flip-chip solder joint interconnects, we studied several catalysts for epoxy/anhydride base no-flow underfill formulations. These catalysts include metal acetylacetonates and imidazolium salts and were found to be potential candidates for no-flow underfill applications based on the curing profile of the formulations, glass transition temperature (Tg), and coefficient of thermal expansion (CTE) of the cured formulations. The added amount of catalyst and hardener has separate effects on curing reaction peak temperature of the prepared formulations, Tg, and CTE of the cured formulations. The added concentration of catalyst mainly affects the curing reaction peak temperature, but has little effect on the Tg and CTE of the cured formulations. The added concentration of hardener mainly affects the Tg and CTE of the cured formulations, but has little effect on the curing reaction peak temperature of these formulations. Water molecule complexed with metal ions in metal acetylacetonates can be released by heating which consequently shifts the curing reaction peak to lower temperatures by several decades of degrees. The curing profile and the correlation between the curing reaction peak temperature as latent catalysts for epoxy/anhydride resins and their decomposition temperature suggests that the decomposition fragments are most likely the active species responsible for initiating polymerization in epoxy/anhydride resin systems.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122750310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Ball bumping and coining operations for TAB and Flip Chip 球碰撞和铸造操作的TAB和倒装芯片

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581269

L. Levine

引用次数: 11

Embedding technology-a chip-first approach using BCB 嵌入技术——采用BCB的芯片优先方法

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581243

M. Topper, K. Buschick, J. Wolf, V. Glaw, R. Hahn, A. Dabek, O. Ehrmann, H. Reichl

{"title":"Embedding technology-a chip-first approach using BCB","authors":"M. Topper, K. Buschick, J. Wolf, V. Glaw, R. Hahn, A. Dabek, O. Ehrmann, H. Reichl","doi":"10.1109/ISAPM.1997.581243","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581243","url":null,"abstract":"With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely together as possible will therefore boost system's performance. Although flip-chipped devices have good performance, design constraints may prevent the placement of pads to comply with flip chip design rules. An additional advantage of the embedding technology is the possibility to employ 3-D stacking, the highest package density. Bare dice and standard passive components were embedded into a ceramic substrate to achieve a common, planar surface. Hence by employing thin-film processing all components can be directly interconnected to the copper routing of the module. Benzocylobutene (BCB) with its low curing temperature is preferred as dielectrical polymer for the embedding technology. Application of bonding or soldering techniques which might limit the reliability is avoided. This offers excellent electrical properties of the wiring system. By planarizing the reverse side of the MCM a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. An SRAM MCM and a Thermotest MCM demonstrate the facibility of the embedding technology.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124092396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22