用于电子封装的叠合技术

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581250

S. Leach, C.N. Ernsberger

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引用次数: 1

摘要

“Colamination”是一种包装技术，在许多方面，它是Cofire陶瓷的一种具有成本效益的有机版本。叠合工艺和材料集已经在CTS开发了好几年。通过制造各种测试车辆和原型，已经为复合衬底开发了广泛的可靠性数据库。CTS最近的工作包括在几个客户应用中对复合基板进行鉴定。本文简要介绍了叠合技术和CTS参与的一些原型工作。我们还描述了一些最新的技术发展，在叠片技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Colamination technology for electronic packaging applications

"Colamination" is a packaging technology that, in many ways, is a cost effective organic version of Cofire ceramic. The Colamination process and material sets have been in development at CTS for several years. An extensive reliability database has been developed for Colaminated substrates through fabrication of various test vehicles and prototypes. Recent work by CTS involves qualification of Colaminated substrates in several customer applications. This abstract briefly describes Colamination technology and some prototype work CTS has been involved with. We also describe some recent technical developments in Colamination technology.

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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