{"title":"用于电子保护的无底漆RTV有机硅","authors":"B. Van Wert, J. Fiori","doi":"10.1109/ISAPM.1997.581254","DOIUrl":null,"url":null,"abstract":"This paper describes a new silicone potting compound, which has been formulated to deliver fast, room-temperature vulcanizing (RTV) cure and excellent adhesion to most common metals and plastics in electronics applications. Dow Corning/sup (R/) 3-4207 Gel has been tested with good results on aluminum, alumina, and copper, as well as PET, FR4 board, and PPS. The material has demonstrated excellent performance on the high-temperature epoxy glass laminates used in circuit board manufacturing. With difficult substrates, a 15-30 minute cure cycle at 60-80 /spl deg/C has been shown to produce excellent interfacial adhesion.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"96 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Primerless RTV silicones for electronic protection\",\"authors\":\"B. Van Wert, J. Fiori\",\"doi\":\"10.1109/ISAPM.1997.581254\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a new silicone potting compound, which has been formulated to deliver fast, room-temperature vulcanizing (RTV) cure and excellent adhesion to most common metals and plastics in electronics applications. Dow Corning/sup (R/) 3-4207 Gel has been tested with good results on aluminum, alumina, and copper, as well as PET, FR4 board, and PPS. The material has demonstrated excellent performance on the high-temperature epoxy glass laminates used in circuit board manufacturing. With difficult substrates, a 15-30 minute cure cycle at 60-80 /spl deg/C has been shown to produce excellent interfacial adhesion.\",\"PeriodicalId\":248825,\"journal\":{\"name\":\"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces\",\"volume\":\"96 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-03-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1997.581254\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1997.581254","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Primerless RTV silicones for electronic protection
This paper describes a new silicone potting compound, which has been formulated to deliver fast, room-temperature vulcanizing (RTV) cure and excellent adhesion to most common metals and plastics in electronics applications. Dow Corning/sup (R/) 3-4207 Gel has been tested with good results on aluminum, alumina, and copper, as well as PET, FR4 board, and PPS. The material has demonstrated excellent performance on the high-temperature epoxy glass laminates used in circuit board manufacturing. With difficult substrates, a 15-30 minute cure cycle at 60-80 /spl deg/C has been shown to produce excellent interfacial adhesion.
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