一种用于高性能涂料和粘合剂的可丝网印刷硅-亚胺浆料

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581255

Jin-O Choi, R. Kirsten, S. Rojstaczer, D. Riordan

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引用次数: 1

摘要

只提供摘要形式。一种新型的可丝网印刷的浆料被开发出来，用作图案保护涂层或粘合剂。这种高纯度，高固含量的浆料是基于高温，热塑性硅-亚胺树脂，提供良好的热稳定性，低吸水性和热熔附着力。对于60 /spl mu/m厚的烘烤层，采用模板或筛网均可获得较好的分辨率图案。完全固化后的涂层吸湿性低，力学性能优良。玻璃化转变温度为165/spl℃。在250℃/spl温度下进行层压，可将完全固化的涂层粘结在alloy 42金属基体上。该浆料可用于非导电的贴片应用，也可用于刚性或柔性电路上的大衣保护层。

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A screen printable silicone-imide paste for high performance coatings and adhesives

Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 /spl mu/m thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165/spl deg/C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250/spl deg/C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits.

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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