Primerless RTV silicones for electronic protection

Abstract

This paper describes a new silicone potting compound, which has been formulated to deliver fast, room-temperature vulcanizing (RTV) cure and excellent adhesion to most common metals and plastics in electronics applications. Dow Corning/sup (R/) 3-4207 Gel has been tested with good results on aluminum, alumina, and copper, as well as PET, FR4 board, and PPS. The material has demonstrated excellent performance on the high-temperature epoxy glass laminates used in circuit board manufacturing. With difficult substrates, a 15-30 minute cure cycle at 60-80 /spl deg/C has been shown to produce excellent interfacial adhesion.