聚合物/陶瓷薄膜电容器在PWB上的集成

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581259

S. Bhattacharya, R. Tummala, P. Chahal, G. White

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引用次数: 11

摘要

研究了各种聚合物-陶瓷复合材料在印制电路板上集成电容器的电学性能。复合材料的介电常数强烈地依赖于聚合物和陶瓷材料的个别性质。环氧树脂因其与印刷电路板的相容性而成为首选材料。此外，在电容器电极的化学镀过程中，环氧材料不会受到高PH环境的侵蚀。利用薄膜工艺和丝网印刷技术对可光定义和不可光定义材料在印制板上的电容器集成进行了评估。选择铌酸铅镁作为填充材料是因为它具有较高的介电常数值和与大多数聚合物的相容性。

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Integration of polymer/ceramic thin film capacitor on PWB

Electrical properties of various polymer-ceramic composites have been studied for use in integrated capacitors on PWB substrates. The dielectric constant of the composite is strongly dependent on the individual properties of polymer and ceramic materials. Epoxy is the material of choice for its compatibility with PWBs. Further, epoxy materials are not attacked by high PH environment during electroless plating of the capacitor electrodes. Photodefinable and nonphotodefinable materials have been evaluated for capacitor integration on PWBs using thin-film processes and screen printing. Lead magnesium niobate is selected as the filler material for its high dielectric constant value and its compatibility with most polymers.

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来源期刊

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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