{"title":"A screen printable silicone-imide paste for high performance coatings and adhesives","authors":"Jin-O Choi, R. Kirsten, S. Rojstaczer, D. Riordan","doi":"10.1109/ISAPM.1997.581255","DOIUrl":null,"url":null,"abstract":"Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 /spl mu/m thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165/spl deg/C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250/spl deg/C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1997.581255","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 /spl mu/m thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165/spl deg/C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250/spl deg/C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits.