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2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)最新文献

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Removal of artificial resonances for divide and conquer analysis using boundary element method 用边界元法去除分治分析中的人为共振
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835444
Swagato Chakraborty, J. Pingenot, M. Mondal
{"title":"Removal of artificial resonances for divide and conquer analysis using boundary element method","authors":"Swagato Chakraborty, J. Pingenot, M. Mondal","doi":"10.1109/EPEPS.2016.7835444","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835444","url":null,"abstract":"This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132194360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Reduced order modeling in FDTD with provable stability beyond the CFL limit 在FDTD中简化阶数建模，可证明超过CFL极限的稳定性
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835427
Xinyue Zhang, Fadime Bekmambetova, P. Triverio
{"title":"Reduced order modeling in FDTD with provable stability beyond the CFL limit","authors":"Xinyue Zhang, Fadime Bekmambetova, P. Triverio","doi":"10.1109/EPEPS.2016.7835427","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835427","url":null,"abstract":"The Finite-Difference Time-Domain (FDTD) method is widely used in signal and power integrity, applied electromagnetism, and physics. Unfortunately, its computational efficiency can be severely degraded for multiscale problems, where small and large features coexist. This scenario is common in signal and power integrity, because of the large aspect ratio of interconnects and power/ground planes. In this paper, we show how multiscale FDTD simulations can be accelerated with model order reduction. A detailed model for complex objects is first generated using a fine FDTD grid. The model is then compressed with model order reduction, and embedded into a main coarse grid. During this process, the stability limit of the reduced model can be also extended, enabling the use of a larger time step in the whole domain. Using a passivity argument, we are able to systematically guarantee the stability of the resulting scheme, which is a main novelty with respect to previous works. A numerical example with two reduced models shows the potential of the proposed ideas.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132266006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Passivity enforcement using incomplete complex frequency hopping 利用不完全复跳频实现无源性
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835413
Y. Xiao, M. Kabir, R. Khazaka
{"title":"Passivity enforcement using incomplete complex frequency hopping","authors":"Y. Xiao, M. Kabir, R. Khazaka","doi":"10.1109/EPEPS.2016.7835413","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835413","url":null,"abstract":"In this paper, an efficient passivity enforcement algorithm for S-parameter based macromodels is proposed. The approach is based on the perturbation of the imaginary eigenvalues of the Hamiltonian Matrix. The CPU cost savings are obtained by selective computation and perturbation of a subset of the imaginary eigenvalues. The proposed approach is shown to be efficient compared to existing state of the art methods.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133589921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Directional hybrid FEM-MoM for automotive system level simulation 面向汽车系统级仿真的定向混合FEM-MoM
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835443
B. Nayak, Sreenivasulu Reddy Vedicherla, D. Gope
{"title":"Directional hybrid FEM-MoM for automotive system level simulation","authors":"B. Nayak, Sreenivasulu Reddy Vedicherla, D. Gope","doi":"10.1109/EPEPS.2016.7835443","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835443","url":null,"abstract":"Electromagnetic compatibility (EMC) issues are becoming increasingly important for the automotive industry. An accurate system level analysis is required from an early design stage for optimal performance. The major difficulty encountered in automotive simulation is to deal with different geometric scales, ranging from fraction of wavelengths to multiple wavelengths. In many cases, a domain decomposition method using Finite Element Method (FEM) and Method of Moments (MoM) may be effective by computing each domain separately and stitching them together using equivalent boundary currents. However, when the problem size becomes larger, this method loses its efficacy as calculation of domain interactions become computationally costly. In this paper a new method is proposed for multi-domain problems in EMC radiation emission (RE) test, based on the fact that when two domains are electrically far apart, the back scattered field from the receiving antenna to DUT is quite minimal and can be neglected. The proposed method demonstrates a substantial reduction in memory requirements and computational time when compared to traditional multi-domain hybrid FEM-MoM with acceptable accuracy.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121765318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Reflection de-embedding for high-speed I/O measurements 高速I/O测量的反射反嵌入
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835435
Sunil R. Sudhakaran, Daniel Lin
{"title":"Reflection de-embedding for high-speed I/O measurements","authors":"Sunil R. Sudhakaran, Daniel Lin","doi":"10.1109/EPEPS.2016.7835435","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835435","url":null,"abstract":"Reflections in high-speed busses can corrupt signal measurements when the probe location is away from the DUT. This paper presents a methodology to remove such reflections. A mathematical formulation of the problem is presented along with solutions to commonly encountered topologies.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"158 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127372099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications 一种基于介质的波导集成在超高速通信的多层PCB中
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835449
Junyan Tang, J. Hejase, J. Myers, S. Connor, D. Dreps, J. Kuczynski
{"title":"A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications","authors":"Junyan Tang, J. Hejase, J. Myers, S. Connor, D. Dreps, J. Kuczynski","doi":"10.1109/EPEPS.2016.7835449","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835449","url":null,"abstract":"This paper presents an electromagnetic dielectric wave guiding methodology for ultra-high speed signaling in a multilayer PCB environment. Two dielectric materials, one of which has a higher dielectric constant than the other, are embedded between the two ground planes of an internal PCB layer to enable wave propagation. Different transmission properties can be achieved by varying the dimensions or material properties of the dielectric waveguide. PCB integrated dielectric waveguides can achieve wide operating frequencies in the millimeter wave region of the frequency spectrum thus showing potential to push high speed bus designs to faster data rates than is currently possible.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114826813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Selective harmonic elimination method of radiation noise from automotive wireless power transfer system using active rectifier 基于有源整流器的汽车无线电力传输系统辐射噪声选择性谐波消除方法
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835441
Hongseok Kim, Seungtaek Jeong, Dong-Hyun Kim, Joungho Kim, Young-il Kim, In-Myoung Kim
{"title":"Selective harmonic elimination method of radiation noise from automotive wireless power transfer system using active rectifier","authors":"Hongseok Kim, Seungtaek Jeong, Dong-Hyun Kim, Joungho Kim, Young-il Kim, In-Myoung Kim","doi":"10.1109/EPEPS.2016.7835441","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835441","url":null,"abstract":"Because wireless power transfer (WPT) systems used in automotive vehicles are likely to cause electromagnetic interference (EMI) with sensors, antennas, and controllers, the magnetic near-field spectrum from a WPT system has to be investigated and controlled properly. In this paper, we propose a selective harmonic elimination (SHE) method of the radiation noise from an automotive WPT system to reduce EMI caused by fast switching transitions of a resonant inverter and rectifier used for WPT systems. The simulated EMI spectra show that the significant reduction up to 30 dB in the harmonic components can be achieved by using the proposed SHE method.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123845446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
New detailed understanding of the mechanism of radiation in interconnect problems 对互连问题中的辐射机制有了新的详细认识
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835454
Y. S. Cao, L. J. Jiang, A. Ruehli, J. Fan, J. Drewniak
{"title":"New detailed understanding of the mechanism of radiation in interconnect problems","authors":"Y. S. Cao, L. J. Jiang, A. Ruehli, J. Fan, J. Drewniak","doi":"10.1109/EPEPS.2016.7835454","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835454","url":null,"abstract":"Electromagnetic radiations from parasitic structures such as electronic interconnections are very difficult to diagnose because the ability to identify the specific sources are missing. Mainly, the source of radiations cannot be identified separately. Here, the partial element equivalent circuit (PEEC) method is extended to diagnose the radiation and its distribution. For the first time we identify the individual sources of radiation and the equivalence circuits for the sources. The proposed approach can be applied to find the radiation for electromagnetic interference (EMI) from a wide variety of structures.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115773586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Crosstalk evaluation between ultra high speed multi-layer compatible PCB dielectric waveguides and reduction using split ring resonators 超高速多层兼容PCB介电波导串扰评估及分环谐振器减少
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835450
J. Myers, J. Hejase, Junyan Tang, D. Dreps, S. Connor, J. Kuczynski
{"title":"Crosstalk evaluation between ultra high speed multi-layer compatible PCB dielectric waveguides and reduction using split ring resonators","authors":"J. Myers, J. Hejase, Junyan Tang, D. Dreps, S. Connor, J. Kuczynski","doi":"10.1109/EPEPS.2016.7835450","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835450","url":null,"abstract":"In this paper, the crosstalk between closely spaced ultra-high speed dielectric waveguides is evaluated. The waveguides are operated at frequencies up to 100GHz, while being integrable in commercially available multi-layered printed circuit boards. The cores of the dielectric waveguides have Megtron6-like material properties while the cladding uses Teflon-like material properties. The crosstalk between the waveguides is evaluated for a variety of waveguide dimensions and spacings between waveguides. A novel technique using split ring resonators to reduce crosstalk between waveguides is introduced. The resonators are placed between the waveguides in order to absorb wave leakage which causes crosstalk, resulting in crosstalk reduction.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":" 21","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133020574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Boosting off-chip interconnects through power line communication 通过电力线通信增强片外互连
2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) Pub Date : 2016-10-01 DOI: 10.1109/EPEPS.2016.7835447
Xiang Zhang, R. Coutts, Chung-Kuan Cheng
{"title":"Boosting off-chip interconnects through power line communication","authors":"Xiang Zhang, R. Coutts, Chung-Kuan Cheng","doi":"10.1109/EPEPS.2016.7835447","DOIUrl":"https://doi.org/10.1109/EPEPS.2016.7835447","url":null,"abstract":"The number of available pins on SOC is one of the limiting factors to the off-chip bandwidth, for example many-core enabled Internet of Things (IoT) devices, where the package size and PCB floorplan are tightly constrained. A typical SOC package allocates more than half of the pins for power delivery, resulting in the number of IO pins for off-chip communications is greatly reduced. We observe the requirement for the number of power and ground (P/G) pins is driven by the highest performance state and the worst design corners, while SOC is in lower performance state for most of the time for longer battery life. Under observation, we propose to reuse some of the power pins as dynamic power/signal pins for off-chip data transmissions to increase the off-chip bandwidth during SOC low performance state. Our proposed method provides 30Gbps bandwidth per hybrid pair, while managing minimum impact to the original power delivery network (PDN) design.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115478139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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