{"title":"Removal of artificial resonances for divide and conquer analysis using boundary element method","authors":"Swagato Chakraborty, J. Pingenot, M. Mondal","doi":"10.1109/EPEPS.2016.7835444","DOIUrl":null,"url":null,"abstract":"This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2016.7835444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.