{"title":"用边界元法去除分治分析中的人为共振","authors":"Swagato Chakraborty, J. Pingenot, M. Mondal","doi":"10.1109/EPEPS.2016.7835444","DOIUrl":null,"url":null,"abstract":"This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.","PeriodicalId":241629,"journal":{"name":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Removal of artificial resonances for divide and conquer analysis using boundary element method\",\"authors\":\"Swagato Chakraborty, J. Pingenot, M. Mondal\",\"doi\":\"10.1109/EPEPS.2016.7835444\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.\",\"PeriodicalId\":241629,\"journal\":{\"name\":\"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2016.7835444\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2016.7835444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Removal of artificial resonances for divide and conquer analysis using boundary element method
This paper presents a mechanism to remove artificial plane resonances using matched termination when analyzing signal channels in a multilayered PCB using a mix of 3D and hybrid boundary element based methodology to model the via transitions and routing areas, respectively.