Crosstalk evaluation between ultra high speed multi-layer compatible PCB dielectric waveguides and reduction using split ring resonators

J. Myers, J. Hejase, Junyan Tang, D. Dreps, S. Connor, J. Kuczynski
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引用次数: 1

Abstract

In this paper, the crosstalk between closely spaced ultra-high speed dielectric waveguides is evaluated. The waveguides are operated at frequencies up to 100GHz, while being integrable in commercially available multi-layered printed circuit boards. The cores of the dielectric waveguides have Megtron6-like material properties while the cladding uses Teflon-like material properties. The crosstalk between the waveguides is evaluated for a variety of waveguide dimensions and spacings between waveguides. A novel technique using split ring resonators to reduce crosstalk between waveguides is introduced. The resonators are placed between the waveguides in order to absorb wave leakage which causes crosstalk, resulting in crosstalk reduction.
超高速多层兼容PCB介电波导串扰评估及分环谐振器减少
本文研究了紧密间隔的超高速介质波导间的串扰。波导的工作频率高达100GHz,同时可集成在商用多层印刷电路板上。介质波导的核心具有类似megtron6的材料特性,而包层使用类似聚四氟乙烯的材料特性。在不同的波导尺寸和波导间距下,对波导间的串扰进行了评估。介绍了一种利用劈开环谐振器减少波导间串扰的新技术。谐振器被放置在波导之间,以吸收引起串扰的漏波,从而减少串扰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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