Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium最新文献_第3页

The use of concentrated hydrogen peroxide for the removal of a TiW ARC from aluminum bond pads 用浓缩过氧化氢去除铝焊盘上的TiW电弧

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626884

R. Danzl, A. McLaurin

{"title":"The use of concentrated hydrogen peroxide for the removal of a TiW ARC from aluminum bond pads","authors":"R. Danzl, A. McLaurin","doi":"10.1109/IEMT.1997.626884","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626884","url":null,"abstract":"The use of concentrated hydrogen peroxide as an agent which etches TiW is well known in the metals industry. Although hydrogen peroxide is used in most semiconductor manufacturing processes, its' application as an etchant for TiW has been limited. Since some Micro-Rel product uses a composite metallization scheme containing a TiW/AlSiCu/TiW sandwich, the bonding pad etch process must include a TiW removal step. Without this step, a residual TiW layer is left on the metal pads causing wire adhesion problems (non-sticks) during the wire bonding processes. Current plasma etch techniques still leave a TiW residue on the aluminum surface. The hydrogen peroxide clean was instituted to minimize the presence of the TiW residue. By inserting this clean as the last step of the pad masking module, a cleaner metal surface was developed. To test the new process, wire pulls were done on product by two separate business units within Medtronic. Results from both areas showed no lifts. Surface analyses of metal bond pads treated with hydrogen peroxide shows a significant decrease in the concentrations of metallic oxides and tungsten. The SEM images of bonding pads show no loss in metal thickness and the metal surface is relative smooth with no trace of TiW visually evident.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124046097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Beyond refractive optical lithography next generation lithography "What's after 193 nm?" 超越折光光刻下一代光刻“193nm之后是什么?”

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626940

P. Seidel, J. Canning, S. Mackay

引用次数: 1

Photomasks for advanced lithography 用于高级光刻的光罩

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626941

W. Smith, W. Tybula

引用次数: 1

The total process cost of selective epitaxial growth (SEG) dielectric isolation process as compared to LOCOS 与LOCOS相比，选择性外延生长(SEG)介电隔离工艺的总工艺成本

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626882

J. Hughes, G. Neudeck

引用次数: 0

MCM design for manufacturability 可制造性的MCM设计

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626879

S. K. Ladd

{"title":"MCM design for manufacturability","authors":"S. K. Ladd","doi":"10.1109/IEMT.1997.626879","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626879","url":null,"abstract":"The MCM industry is lacking many of the standards and defined processes necessary for creating effective design systems. Improving these design systems is critical to the industry's ability to rapidly launch manufacturable products into the market. Significant efforts must be made to overcome major shortcomings in industry infrastructure, concurrent engineering, expertise, and design tools. MCM design requires many elements of both integrated circuit (IC) and printed circuit board (PCB) design. The combination of industry standards and well developed processes has resulted in excellent design systems for developing highly manufacturable products in a timely manner. The current state of MCM design is assessed using the IC design process as a model. Significant industry investment has yielded enormous gains in IC design productivity, time-to-market, and functional costs. The multichip module industry can benefit from similar approaches. The paper gives detailed examples of specific issues concerning modeling components, substrates, and assemblies. Examples of systems for obtaining die data, substrate design rules, and assembly design rules are shown. These examples are from work performed by numerous organizations and are summarized with a snapshot of work on a portable Pentium(R)-based MCM. The results of developing improved MCM design systems will be significant: better products built at lower cost and brought to market quickly.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125589522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Adhesive flip chip assembly using plated bump chips 胶粘剂倒装芯片组装使用镀凹凸芯片

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626937

G. A. Riley

引用次数: 1

The effects of flux materials on the moisture sensitivity and reliability of flip chip on board assemblies 焊剂材料对倒装芯片板上组件的湿度敏感性和可靠性的影响

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626865

C. Beddingfield, L. Higgins

引用次数: 5

Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn/sub 62/Pb/sub 36/Ag/sub 2/ 基于Sn/sub 62/Pb/sub 36/Ag/sub 2/合金冶金行为的软焊点寿命评估

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626927

G. Grossmann, L. Weber

引用次数: 1

Statistical machine control: a practical approach to total productive maintenance of semiconductor equipment 统计机器控制:半导体设备全面生产维护的实用方法

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626881

F. Lavallart, N. Cooper

引用次数: 1

High performance ball grid array utilizing flip chip bonding on buildup printed circuit board 利用倒装芯片键合的高性能球栅阵列

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626947

K. Yamanaka, H. Mori, Y. Tsukada

引用次数: 4