Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium最新文献_第8页

Advanced solder bumping technology through super solder 先进的焊料碰撞技术，通过超级焊料

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626875

K. Hikasa, H. Irie

引用次数: 1

The National Printed Wiring Board Resource Center 国家印制板资源中心

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1900-01-01 DOI: 10.1109/IEMT.1997.626892

P.D. Chalmer

引用次数: 0

Using contract manufacturing services to assist with design solutions in advanced packaging technologies

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1900-01-01 DOI: 10.1109/IEMT.1997.626933

G. Tóth, R.W. Hyora

引用次数: 0

New chip scale package with CTE matching to the board 新的芯片规模封装与CTE匹配的板

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1900-01-01 DOI: 10.1109/IEMT.1997.626909

R. Schueller

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引用次数: 0