先进的焊料碰撞技术，通过超级焊料

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626875

K. Hikasa, H. Irie

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引用次数: 1

摘要

Furukawa Electric开发了一种通过晶格替代将高纯度焊料直接涂在细间距触点上的方法，称为超级焊料(SS)。该技术已被用于安装奔腾芯片的电路板的预涂层。SS通过一个非常简单的过程，包括膏体涂层和加热，为细间距电极垫提供焊料，非常适合凹凸形成的需要，特别是在电路板上。本文介绍了一种高产量、低劳动力要求、低投资的全自动凸块成型生产线的结构和特点。

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Advanced solder bumping technology through super solder

Furukawa Electric has developed method of eluding high-purity solder directly onto fine-pitch contacts through lattice substitution, called Super Solder (SS). The technology has already been adopted in precoating for boards mounting Pentium chips. SS supplies solder to fine-pitch electrode pads through a very simple process consisting of paste coat and heating, and is well suited to the needs of bump formation, especially on boards. This paper covers the configuration and characteristics of a production line providing fully-automatic bump formation with high yield, low labor requirements, and at a low capital investment.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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