Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium最新文献

CSP solder ball reliability CSP焊球可靠性

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626961

M. Ikemizu, Y. Fukuzawa, J. Nakano, T. Yokoi, K. Miyajima, H. Funakura, E. Hosomi

引用次数: 5

Rheological techniques for measuring normal stress differences of solder paste [PCBs] 测量锡膏法向应力差的流变学技术[pcb]

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626897

M. Riedlin, Nduka Nnamdi (Ndy) Ekere

{"title":"Rheological techniques for measuring normal stress differences of solder paste [PCBs]","authors":"M. Riedlin, Nduka Nnamdi (Ndy) Ekere","doi":"10.1109/IEMT.1997.626897","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626897","url":null,"abstract":"Like most solids in liquid suspensions at high solid volume fraction, solder paste exhibits very complicated rheological behaviour. Many rheological characteristics, such as shear thinning, pseudoplasticity, and thixotropy are observed in this material. These characteristics are known to have different impacts on the solder paste's primary application: stencil printing. In fact, at various stages of the printing process, different and sometimes conflicting rheological characteristics ate required of the solder paste. These characteristics have been receiving increasing attention in the solder paste literature. However, one rheological property that has been overlooked is the normal stresses generated in the solder paste. These two stresses are the normal components to the shear stress. These stresses are only found in non-Newtonian materials and are part of its non-linear viscoelastic properties. This paper describes a methodology to measure the normal stress differences of solder paste under steady shear. In the method used to measure the normal stresses, a special type of rheometer, known as a rheogoniometer is used. For comparative normal stress measurements, only certain types of geometries can be used for solder paste. A typical shear rate experiment is described using cone and plate, and parallel plate geometries. Potential errors in the measurements of normal stress differences are also discussed.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127204670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

A two-stage hybrid with uniform machines and setup times 具有统一机器和设置时间的两级混合

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626954

Wanzhen Huang, Shanling Li

引用次数: 0

Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability 发射/接收模块高密度陶瓷基板接地连接焊接技术及其可靠性

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626928

Wang Tingyue, Cui Dianheng, Yu Shenlin, Tang Jun, Y. Wei

引用次数: 1

A study of wafer fab dispatching rules based on empirical flow time predictions 基于经验流时间预测的晶圆厂调度规则研究

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626957

Yi-Feng Hung, Ching-Bin Chang

引用次数: 0

Next generation lithography-implications 下一代光刻技术的启示

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626943

W. Trybula

引用次数: 5

Disassembly process far a cathode ray tube 阴极射线管的拆卸过程

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626887

T. Aanstoos, I. Braithwaite, J. House, D. Robinson, S. Nichols

引用次数: 0

Implementation of overall equipment effectiveness (OEE) system at a semiconductor manufacturer 在一家半导体制造商实施整体设备效率(OEE)系统

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626883

S. Giegling, W.A. Verdini, T. Haymon, J. Konopka

{"title":"Implementation of overall equipment effectiveness (OEE) system at a semiconductor manufacturer","authors":"S. Giegling, W.A. Verdini, T. Haymon, J. Konopka","doi":"10.1109/IEMT.1997.626883","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626883","url":null,"abstract":"Factory capacity is becoming exceedingly expensive and new factories may not reach designed output levels for at least a couple of years. In the semiconductor industry, required investments in new wafer fabrication facilities may exceed $1 billion. As the cost of semiconductor manufacturing facilities continues to escalate and profit margins get squeezed, semiconductor manufacturers must attempt to increase production capabilities in their existing semiconductor manufacturing facilities (FABs). Assessing the utilization of existing capacity is a key component in this effort. One capacity analysis tool that is currently in use within the RF1 wafer fabrication facility of Motorola's Semiconductor Products Sector (SPS) is the Capacity Utilization Bottleneck Efficiency System (CUBES). RF1 is using CUBES to enhance a very progressive Total Productive Manufacturing (TPM) program. CUBES was gradually introduced to RF1 during the summer of 1995 and became widely accepted during the Fall of 1995 after an interface between CUBES and the work in process (WIP) tracking system, PROMIS/sup TM/, was established. The CUBES decision support tool is generally simple to use, but collecting the input tool performance data may be difficult and time consuming. Since direct users of CUBES range from managers to maintenance technicians to operators, it was imperative to develop a system that linked necessary databases together automatically to calculate capacity and Overall Equipment Effectiveness (OEE). This paper discusses the implementation process. To acquaint the reader, we begin with a brief review of the objectives of this project. Following that is a discussion of the components and implementation of this system.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123982122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 33

Flip-chip-on-board (FCOB) assembly and reliability 板上倒装芯片(FCOB)组装和可靠性

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626870

S. Yegnasubramanian, R. Deshmukh, J. Fulton, R. Fanucci, J. Gannon, J. R. Morris, K. Nikmanesh

引用次数: 7

High pin count BGA board level assembly 高引脚数BGA板级组装

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626962

D. Mendez

引用次数: 0