板上倒装芯片(FCOB)组装和可靠性

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626870

S. Yegnasubramanian, R. Deshmukh, J. Fulton, R. Fanucci, J. Gannon, J. R. Morris, K. Nikmanesh

{"title":"板上倒装芯片(FCOB)组装和可靠性","authors":"S. Yegnasubramanian, R. Deshmukh, J. Fulton, R. Fanucci, J. Gannon, J. R. Morris, K. Nikmanesh","doi":"10.1109/IEMT.1997.626870","DOIUrl":null,"url":null,"abstract":"This paper discusses the methods of direct chip attachment (DCA) and the results of interconnect reliability qualification of flip chip assemblies with underfill. The method developed provides a 'dropin' surface mount process to attach bumped silicon devices to laminates utilizing standard surface mount assembly equipment. Assemblies of test vehicles and product modules demonstrated satisfactory results in all of the reliability qualification and product conformance criteria. Results of failure mode analysis (FMA) of assemblies subjected to thermal stress are discussed.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Flip-chip-on-board (FCOB) assembly and reliability\",\"authors\":\"S. Yegnasubramanian, R. Deshmukh, J. Fulton, R. Fanucci, J. Gannon, J. R. Morris, K. Nikmanesh\",\"doi\":\"10.1109/IEMT.1997.626870\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the methods of direct chip attachment (DCA) and the results of interconnect reliability qualification of flip chip assemblies with underfill. The method developed provides a 'dropin' surface mount process to attach bumped silicon devices to laminates utilizing standard surface mount assembly equipment. Assemblies of test vehicles and product modules demonstrated satisfactory results in all of the reliability qualification and product conformance criteria. Results of failure mode analysis (FMA) of assemblies subjected to thermal stress are discussed.\",\"PeriodicalId\":227971,\"journal\":{\"name\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1997.626870\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626870","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

本文讨论了带衬底的倒装芯片组件的直接芯片连接(DCA)方法和互连可靠性鉴定结果。所开发的方法提供了一种“滴下”表面贴装工艺，利用标准表面贴装组装设备将凸起的硅器件贴装到层压板上。测试车辆和产品模块的装配在所有可靠性鉴定和产品一致性标准中显示出令人满意的结果。讨论了热应力作用下组件的失效模式分析结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Flip-chip-on-board (FCOB) assembly and reliability

This paper discusses the methods of direct chip attachment (DCA) and the results of interconnect reliability qualification of flip chip assemblies with underfill. The method developed provides a 'dropin' surface mount process to attach bumped silicon devices to laminates utilizing standard surface mount assembly equipment. Assemblies of test vehicles and product modules demonstrated satisfactory results in all of the reliability qualification and product conformance criteria. Results of failure mode analysis (FMA) of assemblies subjected to thermal stress are discussed.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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