High pin count BGA board level assembly

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626962

D. Mendez

引用次数: 0

Abstract

Successful processing of high pin count Ball Grid Array (BGA) components through an assembly operation is dependant upon many factors including solder paste deposition, component placement, and quality of the raw materials including the printed wiring boards (PWB) and the BGA components.

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高引脚数BGA板级组装

通过组装操作成功处理高引脚数球栅阵列(BGA)组件取决于许多因素，包括焊膏沉积，组件放置和原材料的质量，包括印刷线路板(PWB)和BGA组件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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