发射/接收模块高密度陶瓷基板接地连接焊接技术及其可靠性

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626928

Wang Tingyue, Cui Dianheng, Yu Shenlin, Tang Jun, Y. Wei

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引用次数: 1

摘要

有源相控阵雷达收发模块的工作频率非常高(至少在1000mhz以上)。功能元件背面金属镀层与T/R模块基板载体之间的接地连接非常重要，直接影响到功能元件与T/R模块的性能和可靠性。本文主要研究了以下技术:薄膜或厚膜微波电路衬底上、背面通孔的导通性和可靠性，焊接应力和变形的控制;可用材料的可焊性;以及焊接加工技术。高可靠性的T/R模块通过使用焊接代替螺钉成功制造。

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Ground connection soldering techniques of high density ceramics substrate of transmit/receive module and its reliability

The operation frequency of Transmit/Receive (T/R) module for active phased-array radar is very high (at least above 1000 MHz). The ground connection between the back side metal plating of the functional elements and the substrate carrier of the T/R module is so important that it can directly affect the performance and reliability of the functional elements and T/R module. In this paper, the following techniques are studied: conduction and reliability of the via hole between top side and back side of the thin film or thick film microwave circuit substrate, control of soldering stress and deformations; solderability of available materials; and soldering processing technology. Highly reliable T/R modules are successfully manufactured by using soldering in place of screws.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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