G. Tóth, R.W. Hyora
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引用次数: 0

摘要

电子产品公司(oem)在处理将新产品推向市场的许多不同需求时面临着难题。这些需求包括:更高的系统性能;更大的功能集;降低成本;减小尺寸和重量。为了满足这些需求,工程师们越来越多地转向先进的封装技术来寻求解决方案。然而,从这些技术中获得的最佳结果往往只有在使用非传统设计方法时才能获得。当设计师们第一次探索先进的包装替代品时,他们往往会忽略宝贵的资源——合同制造商。他们中的许多人在各种技术方面经验丰富,并为客户提供设计服务和生产服务。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Using contract manufacturing services to assist with design solutions in advanced packaging technologies
Electronic product companies (OEMs) face difficult problems today when dealing with the many divergent demand of bringing new products to market. These demands include: Higher system performance; greater feature set; reduced costs; reduced size and weight. Responding to these demands, engineers are increasingly turning to advanced packaging technologies for solutions. However, the best results from these technologies are often obtained only when non-traditional design approaches are used. Designers often overlook valuable resources when they are first exploring advanced packaging alternatives-contract manufacturers. Many of them are experienced with a variety of these technologies and offer their customers design services as well as production services.
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