Advanced solder bumping technology through super solder

Abstract

Furukawa Electric has developed method of eluding high-purity solder directly onto fine-pitch contacts through lattice substitution, called Super Solder (SS). The technology has already been adopted in precoating for boards mounting Pentium chips. SS supplies solder to fine-pitch electrode pads through a very simple process consisting of paste coat and heating, and is well suited to the needs of bump formation, especially on boards. This paper covers the configuration and characteristics of a production line providing fully-automatic bump formation with high yield, low labor requirements, and at a low capital investment.