基于Sn/sub 62/Pb/sub 36/Ag/sub 2/合金冶金行为的软焊点寿命评估

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626927

G. Grossmann, L. Weber

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引用次数: 1

摘要

新封装的引入以及SMT中正在进行的小型化使得焊点可靠性的评估成为一项永久性任务。被动热循环是评价焊点寿命的一项重要试验。然而，锡铅焊料表现为粘塑性。因此，在设计加速试验时，必须考虑焊料的冶金性能。根据试验温度和温度梯度的不同，出现了两种不同的变形机制:晶界滑动(GBS)和位错爬升(DC)。因此，人们不能自由选择测试周期的参数，因为测试参数(温度斜坡，停留时间)对裂纹的生长有重大影响。此外，还必须考虑使用条件下的应力。

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Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn/sub 62/Pb/sub 36/Ag/sub 2/

The introduction of new packages as well as the ongoing miniaturisation in SMT make the evaluation of the reliability of solder joints a permanent task. Passive thermal cycling is an important test to evaluate the lifetime of solder joints. However, tin-lead solder behaves viscoplastically. Therefore it is mandatory to take the metallurgical behaviour of the solder into account when accelerated tests are designed. Two different deformation mechanisms occur, depending on the temperatures of the test as well as the temperature gradient: grain boundary sliding (GBS) and dislocation climb (DC). Therefore, one is not free in choosing the parameters of a test cycle because test parameters (temperature ramp, dwell time) have a major influence on the growth of cracks. Furthermore the stress under service conditions must be taken into account.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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