High performance ball grid array utilizing flip chip bonding on buildup printed circuit board

Abstract

A flip chip bonding on a buildup Printed Circuit Board (PCB) has been emerging in a chip carrier area. As chip performance has been improving rapidly, it is now required to have a high performance chip carrier. This paper demonstrates a Ball Grid Array (BGA) application where a flip chip bonding on a multiple buildup layer PCB has an essential electrical performance for a high performance chip which has more than 1000 I/Os and more than 128 bit bus operating at 100 MHz. The effect of a ground plane and a power/ground pick up path design on crosstalk and ground bounce is discussed using SLC-BGA. Also discussed is a package electrical performance comparing various package types. We conclude that flip chip bonding on multiple buildup layer PCB technology is essential for a high performance chip carrier.