MCM design for manufacturability

S. K. Ladd
{"title":"MCM design for manufacturability","authors":"S. K. Ladd","doi":"10.1109/IEMT.1997.626879","DOIUrl":null,"url":null,"abstract":"The MCM industry is lacking many of the standards and defined processes necessary for creating effective design systems. Improving these design systems is critical to the industry's ability to rapidly launch manufacturable products into the market. Significant efforts must be made to overcome major shortcomings in industry infrastructure, concurrent engineering, expertise, and design tools. MCM design requires many elements of both integrated circuit (IC) and printed circuit board (PCB) design. The combination of industry standards and well developed processes has resulted in excellent design systems for developing highly manufacturable products in a timely manner. The current state of MCM design is assessed using the IC design process as a model. Significant industry investment has yielded enormous gains in IC design productivity, time-to-market, and functional costs. The multichip module industry can benefit from similar approaches. The paper gives detailed examples of specific issues concerning modeling components, substrates, and assemblies. Examples of systems for obtaining die data, substrate design rules, and assembly design rules are shown. These examples are from work performed by numerous organizations and are summarized with a snapshot of work on a portable Pentium(R)-based MCM. The results of developing improved MCM design systems will be significant: better products built at lower cost and brought to market quickly.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626879","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The MCM industry is lacking many of the standards and defined processes necessary for creating effective design systems. Improving these design systems is critical to the industry's ability to rapidly launch manufacturable products into the market. Significant efforts must be made to overcome major shortcomings in industry infrastructure, concurrent engineering, expertise, and design tools. MCM design requires many elements of both integrated circuit (IC) and printed circuit board (PCB) design. The combination of industry standards and well developed processes has resulted in excellent design systems for developing highly manufacturable products in a timely manner. The current state of MCM design is assessed using the IC design process as a model. Significant industry investment has yielded enormous gains in IC design productivity, time-to-market, and functional costs. The multichip module industry can benefit from similar approaches. The paper gives detailed examples of specific issues concerning modeling components, substrates, and assemblies. Examples of systems for obtaining die data, substrate design rules, and assembly design rules are shown. These examples are from work performed by numerous organizations and are summarized with a snapshot of work on a portable Pentium(R)-based MCM. The results of developing improved MCM design systems will be significant: better products built at lower cost and brought to market quickly.
可制造性的MCM设计
MCM行业缺乏创建有效设计系统所需的许多标准和定义过程。改进这些设计系统对于该行业快速向市场推出可制造产品的能力至关重要。必须作出重大努力来克服工业基础设施、并行工程、专业知识和设计工具中的主要缺点。MCM设计需要集成电路(IC)和印刷电路板(PCB)设计的许多元素。行业标准和完善的流程相结合,形成了优秀的设计系统,可以及时开发高度可制造的产品。以集成电路设计过程为模型,对MCM设计的现状进行了评估。大量的行业投资在集成电路设计生产力、产品上市时间和功能成本方面产生了巨大的收益。多芯片模块产业可以从类似的方法中受益。本文给出了有关建模组件,基板和组件的具体问题的详细示例。给出了用于获取模具数据、基板设计规则和装配设计规则的系统示例。这些示例来自许多组织所执行的工作,并以基于便携式Pentium(R)的MCM上的工作快照进行总结。开发改进的MCM设计系统的结果将是显著的:以更低的成本制造出更好的产品,并迅速推向市场。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信