The effects of flux materials on the moisture sensitivity and reliability of flip chip on board assemblies

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626865

C. Beddingfield, L. Higgins

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引用次数: 5

Abstract

This paper will discuss the non-proprietary aspects of the work-in-progress regarding developments in flux materials to improve the moisture-induced stress sensitivity of Flip Chip Plastic Ball Grid Array devices. Studies addressing the moisture characterization and pre-conditioning, using JEDEC Level 3, of assemblies built with four proprietary fluxes and two alternative underfill materials will be presented, This report includes the evaluation of the weight loss during a simulated die attach reflow profile for each flux type using thermogravimetric analysis. Also, the underfill adhesion strength to the die surface after assembly, after moisture preconditioning and after 48 hours of autoclave stressing will be discussed. The integrity of the solder joint corresponding to each flux type and measured using die pull techniques will also be presented. The effects of the experimental variables on underfill to die/substrate adhesion will also be reveiwed using C-SAM imaging methods.

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焊剂材料对倒装芯片板上组件的湿度敏感性和可靠性的影响

本文将讨论关于改善倒装芯片塑料球栅阵列器件的湿气应力敏感性的磁通材料发展的非专利方面的工作。本报告将介绍使用JEDEC Level 3对四种专用助焊剂和两种可选底填材料制成的组件进行水分表征和预调节的研究。该报告包括使用热重分析对每种助焊剂类型的模拟模具附加回流曲线进行重量损失评估。此外，还将讨论装配后、水分预处理后和高压灭菌48小时后的下填料与模具表面的粘附强度。焊点的完整性对应于每种助焊剂类型和测量使用模具拉技术也将提出。实验变量对下填料与模具/衬底粘附的影响也将使用C-SAM成像方法进行回顾。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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