Adhesive flip chip assembly using plated bump chips

Abstract

While research on adhesive flip chip interconnection is growing rapidly, there has been little information available about how to apply this research to making practical adhesive flip chip assemblies. This paper describes two techniques- stenciled adhesive assembly, and dipped adhesive assembly- of the several available for flip chip interconnections between chip and substrate. Key features and differences of the two methods are discussed and illustrated with examples. The relative advantages, disadvantages, and limitations of the two methods are compared.