Electrical Performance of Electronic Packaging最新文献_第5页

Numerical modeling of inductance for a distributed system 分布式系统电感的数值模拟

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634044

R. Gravrok, A. Byers, M. Piket-May

引用次数: 0

Significance of electromagnetic coupling through vias in electronics packaging 电子封装中通孔电磁耦合的意义

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634056

Jin Zhao, J. Fang

引用次数: 14

High frequency characterization of interconnection on glass fiber inforced PCB (G30) 玻璃纤维增强PCB互连的高频特性(G30)

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634042

A. Owzar, C. Weickhmann, F. Fazelpour, P. Windirsch, J. Reimers, H. Reichl

引用次数: 2

Characterization, modeling and optimization of high power module packaging 大功率模块封装的特性、建模和优化

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634049

M. Trivedi, K. Shenai

引用次数: 0

S/390 cost performance considerations for packaging choices S/390包装选择的性价比考虑

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634025

G. Katopis, W. Becker

引用次数: 0

Design methodology for chip-on-chip applications 片上应用的设计方法

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634024

Y. Low, R. Frye, K. O'Connor

引用次数: 11

Improving the efficiency of multipole-accelerated method-of-moments solvers using dual grid multipole expansions 利用双网格多极展开提高多极加速矩法求解的效率

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634079

J.-R. Li, J. White

引用次数: 0

Delta-I noise avoidance methodology for high performance chip designs [CMOS microprocessors] 高性能芯片设计的Delta-I噪声避免方法[CMOS微处理器]

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634030

M. Cases, B. Singh, H. Smith

引用次数: 7

On-chip interconnect modeling technologies 片上互连建模技术

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634034

E. A. Dengi, R. Rohrer

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引用次数: 2

Characterizing N-port packages and interconnections with a 2-port network analyzer 用2端口网络分析仪表征n端口包和互连

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634062

S. Sercu, L. Martens

引用次数: 37