{"title":"大功率模块封装的特性、建模和优化","authors":"M. Trivedi, K. Shenai","doi":"10.1109/EPEP.1997.634049","DOIUrl":null,"url":null,"abstract":"This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"404 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characterization, modeling and optimization of high power module packaging\",\"authors\":\"M. Trivedi, K. Shenai\",\"doi\":\"10.1109/EPEP.1997.634049\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"404 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634049\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634049","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization, modeling and optimization of high power module packaging
This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are performed to study the performance and failure of IGBTs under short-circuit and clamped inductive switching stress.
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