Electrical Performance of Electronic Packaging最新文献

Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations 降低分板封装配置中同时开关噪声的低成本技术

Electrical Performance of Electronic Packaging Pub Date : 1998-11-01 DOI: 10.1109/96.730428

S. Koike, K. Kaizu

引用次数: 1

Time domain multiconductor transmission line analysis using effective internal impedance 时域多导体传输线有效内阻抗分析

Electrical Performance of Electronic Packaging Pub Date : 1997-12-01 DOI: 10.1109/EPEP.1997.634083

Sangwoo Kim, D. Neikirk

引用次数: 9

Circuit modeling of isolation in flip-chip microwave integrated circuits 倒装微波集成电路的隔离电路建模

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634074

R. Ito, R. Jackson

引用次数: 0

Packaging and power distribution design considerations for a Sun Microsystems desktop workstation Sun Microsystems桌面工作站的封装和配电设计考虑

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634028

L. Smith

引用次数: 30

Suppression of leakage and crosstalk in typical millimeter-wave flip-chip packages 典型毫米波倒装封装中泄漏和串扰的抑制

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634069

G. Lee, Hai-Young Lee

引用次数: 1

The PSTD algorithm: a fast and accurate time-domain method for electronic package characterization PSTD算法:一种快速、准确的电子封装表征时域方法

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634059

Q. Liu, Y. Li, J. Liao

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引用次数: 1

Characterization of peripheral and core SSOs in a flip-chip package 倒装封装中外设和核心sso的特性

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634053

R. Kollipara, L. Lin, G. Oehrle

引用次数: 0

Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages 埋在高速塑料封装中的耦合键合线的宽带串扰分析

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634046

Sang-Ki Yun, Hai-Young Lee

引用次数: 3

Reduction of high-speed signal distortions in double-layered dielectric PCB interconnects 双层介质PCB互连中高速信号失真的降低

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634040

T. Gazizov, N. Leontiev

引用次数: 10

The enhancement of static simulator package characterization through conductor segmentation 通过导体分割增强静态模拟器封装特性

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634043

G. Klemens, V. Aparin, K. Gard

引用次数: 5