{"title":"降低分板封装配置中同时开关噪声的低成本技术","authors":"S. Koike, K. Kaizu","doi":"10.1109/96.730428","DOIUrl":null,"url":null,"abstract":"A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations\",\"authors\":\"S. Koike, K. Kaizu\",\"doi\":\"10.1109/96.730428\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"137 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/96.730428\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/96.730428","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations
A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate material, the noise is reduced about 50% when 32 switching gates are simultaneously driven at 622.08 Mb/s in a sub-board with an area of 11/spl times/10 cm.
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