Electrical Performance of Electronic Packaging最新文献

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The electrical challenges of packaging the IBM AS/400 封装IBM AS/400的电气挑战
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634023
G.K. Bartley, P.E. Dahlen
{"title":"The electrical challenges of packaging the IBM AS/400","authors":"G.K. Bartley, P.E. Dahlen","doi":"10.1109/EPEP.1997.634023","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634023","url":null,"abstract":"The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130362618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis 3D全局互连参数提取器全芯片全局关键路径分析
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634036
S. Oh, K. Okasaki, J. Moll, O. S. Nakagawa, N. Chang
{"title":"3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis","authors":"S. Oh, K. Okasaki, J. Moll, O. S. Nakagawa, N. Chang","doi":"10.1109/EPEP.1997.634036","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634036","url":null,"abstract":"A 3D Global Interconnect Parameter ExtractoR (GIPER) has been developed to provide a practical extraction tool for the full-chip global critical path analysis. It extracts the interconnect parameters (R,C) of a typical global interconnect within several minutes per net on a HP 9000/755 workstation within 5% accuracy compared to full 3D numerical simulations.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129533127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Experimental electrical characterization of on-chip interconnects 片上互连的实验电学特性
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634038
B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell
{"title":"Experimental electrical characterization of on-chip interconnects","authors":"B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell","doi":"10.1109/EPEP.1997.634038","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634038","url":null,"abstract":"This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130881494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Modelling and simulation of electromagnetic interference in electronic circuits 电子电路中电磁干扰的建模与仿真
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634058
P. Nordholz, H. Grabinski
{"title":"Modelling and simulation of electromagnetic interference in electronic circuits","authors":"P. Nordholz, H. Grabinski","doi":"10.1109/EPEP.1997.634058","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634058","url":null,"abstract":"A new approach for the time-domain analysis of transmission lines exposed to arbitrary external fields is presented. The approach is robust enough to make it compatible with virtually any line model and circuit simulator. The deviation between exact values and simulation results is less than 1%.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130905640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A method for evaluating effect of package resonances on circuit performance [microstrip circuits] 一种评价封装谐振对电路性能影响的方法[微带电路]
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634075
H. Cebi, K. Gupta
{"title":"A method for evaluating effect of package resonances on circuit performance [microstrip circuits]","authors":"H. Cebi, K. Gupta","doi":"10.1109/EPEP.1997.634075","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634075","url":null,"abstract":"A network modeling approach is used to estimate the effect of package resonance on performance of microstrip circuits. An example of two-stage MESFET amplifier illustrates the methodology developed.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121100804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Simulation of large packaged dense microwave circuits 大型封装密集微波电路的仿真
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634068
P. Petre, G. Valley, R. T. Kihm, S. Gedney
{"title":"Simulation of large packaged dense microwave circuits","authors":"P. Petre, G. Valley, R. T. Kihm, S. Gedney","doi":"10.1109/EPEP.1997.634068","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634068","url":null,"abstract":"A new fast method of moments code is used to predict the performance and calculate the electromagnetic properties of packaged, dense, planar microwave circuits. It is demonstrated that circuits as large as transmit/receive (T/R) modules that cannot be simulated accurately with commercial tools can be modeled with this method.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129218568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Survey of model reduction techniques for analysis of package and interconnect models of high-speed designs 高速设计中封装和互连模型分析的模型简化技术综述
Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI: 10.1109/EPEP.1997.634082
E. Chiprout, T. Nguyen
{"title":"Survey of model reduction techniques for analysis of package and interconnect models of high-speed designs","authors":"E. Chiprout, T. Nguyen","doi":"10.1109/EPEP.1997.634082","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634082","url":null,"abstract":"An overview of the recent advances in model reduction techniques of linear interconnect and packaging models for the purpose of simulation is given. The importance of different methods for accuracy, stability and generality are highlighted.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115030363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Quasi-TEM model for coplanar waveguide on silicon 硅基共面波导的准透射电镜模型
Electrical Performance of Electronic Packaging Pub Date : 1997-10-01 DOI: 10.1109/EPEP.1997.634076
D.F. Williams, M. Janezic, A. Ralston, R. S. List
{"title":"Quasi-TEM model for coplanar waveguide on silicon","authors":"D.F. Williams, M. Janezic, A. Ralston, R. S. List","doi":"10.1109/EPEP.1997.634076","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634076","url":null,"abstract":"This paper compares a simple quasi-TEM model for coplanar waveguide fabricated on moderately doped silicon substrates to measurement. While the coplanar waveguide currents and magnetic fields are unaffected by the substrate, a simple capacitive model can accurately account for the effects of the substrate.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132433816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
A technique for fast calculations of capacitance matrices of interconnect structures 互连结构电容矩阵的快速计算技术
Electrical Performance of Electronic Packaging Pub Date : 1900-01-01 DOI: 10.1109/EPEP.1997.634081
V. Veremey, R. Mittra
{"title":"A technique for fast calculations of capacitance matrices of interconnect structures","authors":"V. Veremey, R. Mittra","doi":"10.1109/EPEP.1997.634081","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634081","url":null,"abstract":"A finite difference (FD) method for rapid and accurate evaluation of capacitance matrices of interconnect configurations is described. Novel techniques for the truncation of FD mesh, that significantly reduce the CPU time, are presented.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121059899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
An introduction to the fast-MoM in computational electromagnetics 计算电磁学中快速模态的介绍
Electrical Performance of Electronic Packaging Pub Date : 1900-01-01 DOI: 10.1109/EPEP.1997.634077
A. Baghai-Wadji
{"title":"An introduction to the fast-MoM in computational electromagnetics","authors":"A. Baghai-Wadji","doi":"10.1109/EPEP.1997.634077","DOIUrl":"https://doi.org/10.1109/EPEP.1997.634077","url":null,"abstract":"Summary form only given. The characterisation and design of microwave packaging, and the need for predicting the radiation directivity and interference pattern of novel interconnect structures, and also the necessity for validating simpler models, all require rigorous numerical methods and fast algorithms which allow parallel computing. To this end integral- rather than differential-formulations seem to be advantageous. The various formulations of integral equations in computational electromagnetics involve volume and surface integrals, which, generally, have to be solved numerically. For nearly three decades Harrington's method of moments (MoMs) has been successfully used to discretize these integrals and to obtain reliable approximations to the field solutions. However, MoM has three drawbacks: (1) The resulting (frequency-dependent impedance) matrices are dense. (2) The interaction coefficients (nondiagonal matrix elements) are Fourier-type integrals, and their numerical calculation is comparatively time consuming. (3) The selfaction coefficients (diagonal matrix elements) are Fourier-type singular integrals, and have to be evaluated carefully in Cauchy's sense (Hadamard's finite part). The author's recent efforts to remove these drawbacks have led to the fast-MoM. In many applications fast-MoM eliminates the difficulties in (2) and (3), and if combined with the wavelet analysis relaxes the drawback in (1). In this review the author first briefly points out useful features of the wavelet theory, and emphasizes the role of iterative techniques for solving large matrix equations. He then focuses on the problems in (2) and (3).","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134446374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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