B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell
{"title":"Experimental electrical characterization of on-chip interconnects","authors":"B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell","doi":"10.1109/EPEP.1997.634038","DOIUrl":null,"url":null,"abstract":"This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.