3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis

Abstract

A 3D Global Interconnect Parameter ExtractoR (GIPER) has been developed to provide a practical extraction tool for the full-chip global critical path analysis. It extracts the interconnect parameters (R,C) of a typical global interconnect within several minutes per net on a HP 9000/755 workstation within 5% accuracy compared to full 3D numerical simulations.