{"title":"通过导体分割增强静态模拟器封装特性","authors":"G. Klemens, V. Aparin, K. Gard","doi":"10.1109/EPEP.1997.634043","DOIUrl":null,"url":null,"abstract":"A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"141 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"The enhancement of static simulator package characterization through conductor segmentation\",\"authors\":\"G. Klemens, V. Aparin, K. Gard\",\"doi\":\"10.1109/EPEP.1997.634043\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"141 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634043\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634043","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The enhancement of static simulator package characterization through conductor segmentation
A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along the leads than when whole conductors are used.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
