{"title":"双层介质PCB互连中高速信号失真的降低","authors":"T. Gazizov, N. Leontiev","doi":"10.1109/EPEP.1997.634040","DOIUrl":null,"url":null,"abstract":"Characteristics of single and coupled suspended and inverted microstrip lines are calculated by variational method. Experimental waveforms for usual and suspended microstrip are compared. The possibilities of reduction of high-speed signal distortions in PCBs with such lines are shown.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Reduction of high-speed signal distortions in double-layered dielectric PCB interconnects\",\"authors\":\"T. Gazizov, N. Leontiev\",\"doi\":\"10.1109/EPEP.1997.634040\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Characteristics of single and coupled suspended and inverted microstrip lines are calculated by variational method. Experimental waveforms for usual and suspended microstrip are compared. The possibilities of reduction of high-speed signal distortions in PCBs with such lines are shown.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634040\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634040","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reduction of high-speed signal distortions in double-layered dielectric PCB interconnects
Characteristics of single and coupled suspended and inverted microstrip lines are calculated by variational method. Experimental waveforms for usual and suspended microstrip are compared. The possibilities of reduction of high-speed signal distortions in PCBs with such lines are shown.
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