倒装封装中外设和核心sso的特性

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634053

R. Kollipara, L. Lin, G. Oehrle

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引用次数: 0

摘要

对放置在倒装芯片外围和核心的各种SSO(同步开关输出)缓冲器进行了电气特性分析。多层CBGA封装具有多个电源层、接地层和信号路由层。方法学指导方针是根据表征结果制定的。

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Characterization of peripheral and core SSOs in a flip-chip package

Electrical characterization of various SSO (simultaneous switching output) buffers placed on the periphery and in the core of a flip-chip is performed. The multilayer CBGA package has multiple power and ground planes and signal routing layers. Methodology guide lines are developed based on the characterization results.

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Electrical Performance of Electronic Packaging

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