High frequency characterization of interconnection on glass fiber inforced PCB (G30)

Abstract

One of the main limitations for the application of the MCM approach is the factor of costs. This problem can be solved by using low cost PCB substrate material. It must be assured, that PCB materials can meet the demands on the interconnection parameter for MCM wiring systems. It is shown by measurement results, that the line impedance is in the required range for MCM application. However, the increase in wiring integration can be a handicap regarding the coupling factor.