Numerical modeling of inductance for a distributed system

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634044

R. Gravrok, A. Byers, M. Piket-May

引用次数: 0

Abstract

This paper presents a novel method for calculating the lumped inductance of a 3D distributed system. The inductance of a complex power distribution structure is extracted using a system level approach. The method is validated against theoretical solutions.

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分布式系统电感的数值模拟

本文提出了一种计算三维分布式系统集总电感的新方法。采用系统级方法提取复杂配电结构的电感。用理论解对该方法进行了验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Electrical Performance of Electronic Packaging

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