IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第7页

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IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI: 10.1109/TCPMT.2024.3504053

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Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio 5G认知无线电四端口MIMO Al₂O₃陶瓷集成可重构宽带传感通信介质天线

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-27 DOI: 10.1109/TCPMT.2024.3507277

Jayant Kumar Rai;Pinku Ranjan;Rakesh Chowdhury;Mohd Haizal Jamaluddin

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Heterogeneous Integration Enabled by 3-D Stitch-Chips 3-D拼接芯片实现异构集成

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-27 DOI: 10.1109/TCPMT.2024.3507552

Shane Oh;Zhonghao Zhang;Geyu Yan;Paul K. Jo;Muhannad S. Bakir

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A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging 基于高密度互连封装的低轮廓滤波磁电偶极子天线

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-27 DOI: 10.1109/TCPMT.2024.3507083

Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao

{"title":"A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging","authors":"Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao","doi":"10.1109/TCPMT.2024.3507083","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3507083","url":null,"abstract":"In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from <inline-formula> <tex-math>$0.25lambda _{0}$ </tex-math></inline-formula> of conventional ME dipoles to <inline-formula> <tex-math>$0.07lambda _{0}$ </tex-math></inline-formula>. Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"206-213"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Ultrawideband Filtering Phased Array Antenna Based on Multilayer PCB and BGA-Via for AESA Vertical Heterogeneous Integration 基于多层PCB和BGA-Via的AESA垂直异构集成超宽带滤波相控阵天线

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-27 DOI: 10.1109/TCPMT.2024.3506733

Dalong Xu;Chaofeng Xing;Yongrong Shi;Xun Jiang;Xiangxiang Li;Hao Wang;Qihui Wu

{"title":"Ultrawideband Filtering Phased Array Antenna Based on Multilayer PCB and BGA-Via for AESA Vertical Heterogeneous Integration","authors":"Dalong Xu;Chaofeng Xing;Yongrong Shi;Xun Jiang;Xiangxiang Li;Hao Wang;Qihui Wu","doi":"10.1109/TCPMT.2024.3506733","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3506733","url":null,"abstract":"In this article, an ultrawideband (UWB) filtering phased array antenna is proposed based on the tightly coupled dipole concept by introducing short-terminal vias and open-terminal vias in the radiation unit cells. The short-terminal vias and the open-terminal vias contribute to the low and high radiation nulls, respectively, which are also evaluated simply. Then, a vertical integrated Marchand balun is applied to feed the coupled dipole and the short-terminal vias are combined as its ground via array. Thus, the proposed UWB filtering phased array antenna can be designed using the multilayer printed circuit broad (PCB) with low profile. To achieve a large ratio between via height and via diameter, the BGA-via technique is also used for the phased array antenna design. Then, the active reflection coefficients are simulated and the resonances within its operating band are analyzed for <inline-formula> <tex-math>$theta =60^{circ }$ </tex-math></inline-formula> scan in the E-plane and H-plane. Finally, a phased array antenna prototype is fabricated and assembled to demonstrate the designed performances, including active voltage standing wave ratio (VSWR), antenna gain, and antenna patterns from 5 to 15.5 GHz. About 15-dB radiation suppression performances can be provided out of the band, which can be further improved by cooperating with the front-end chips to relieve the application of the high-performance filter chips in the array. The measured results show agreement with the simulated ones, and the discrepancies at low frequencies are caused by the air gaps within the array.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"182-195"},"PeriodicalIF":2.3,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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All-Frequency-Three-Port-Reflectionless Wideband Filtering Power Divider Using Self-Packaged SCPW-MS With Broadside-Coupled Technique 采用宽边耦合技术的自封装 SCPW-MS 全频三端口无反射宽带滤波功率分配器

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-22 DOI: 10.1109/TCPMT.2024.3504837

Xiao-Fang Li;Jian-Kang Xiao

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Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration 三维非均质集成的大电流细粒度供电研究

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-21 DOI: 10.1109/TCPMT.2024.3503599

Sourish S. Sinha;Pouria Zaghari;Jong Eun Ryu;Bill Batchelor;Raymond A. Fillion;Douglas C. Hopkins

{"title":"Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration","authors":"Sourish S. Sinha;Pouria Zaghari;Jong Eun Ryu;Bill Batchelor;Raymond A. Fillion;Douglas C. Hopkins","doi":"10.1109/TCPMT.2024.3503599","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3503599","url":null,"abstract":"This article demonstrates design guidelines and development of a novel 3-D heterogeneous integration (3-DHI) thin glass substrate-based half-bridge switching power module for future onboard CPU, transceivers, and so on, power delivery applications. Due to extreme space constraints in onboard power supply applications, this design will support switching frequencies of >50 MHz with power levels of >30 W. To illustrate the capabilities of this module, the detailed ANSYS finite element analysis (FEA) analysis was carried out through thermomechanical and electromagnetic simulations. Extracting thermals is a major limitation factor in a compact layout. Hence, a thermal via density and substrate thickness parametric study was conducted, and effects on the integrity of the mechanical structure were verified through the simulation-based stress analysis. Finally, to switch at very high frequencies, the power and signal loop interconnects were routed through a thin glass substrate to achieve ultralow-power and gate loop parasitics. Two significant contributions demonstrate stacking various component layers in a half-bridge power stage and system-level packaging in a vertical profile.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2258-2270"},"PeriodicalIF":2.3,"publicationDate":"2024-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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A High Coupling Coefficient and Symmetric Transformer Based on TSV 基于TSV的高耦合系数对称变压器

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-20 DOI: 10.1109/TCPMT.2024.3503561

Yue Deng;Fengjuan Wang;Xiangkun Yin;Yuan Yang;Ningmei Yu;Yan Li

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High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-18 DOI: 10.1109/TCPMT.2024.3501401

Xin Guo;Yang Tao;Wen Wu

{"title":"High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line","authors":"Xin Guo;Yang Tao;Wen Wu","doi":"10.1109/TCPMT.2024.3501401","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3501401","url":null,"abstract":"In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 2","pages":"356-366"},"PeriodicalIF":2.3,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143446361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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PCB Layout-Based Spatiotemporal Graph Convolution Network for Anomaly Prediction in Solder Paste Printing 基于PCB布置图的锡膏印刷异常预测时空图卷积网络

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-11-18 DOI: 10.1109/TCPMT.2024.3502137

Binkun Liu;Yu Kang;Yun-Bo Zhao;Yang Cao;Zhenyi Xu

{"title":"PCB Layout-Based Spatiotemporal Graph Convolution Network for Anomaly Prediction in Solder Paste Printing","authors":"Binkun Liu;Yu Kang;Yun-Bo Zhao;Yang Cao;Zhenyi Xu","doi":"10.1109/TCPMT.2024.3502137","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3502137","url":null,"abstract":"Predicting solder paste printing anomaly on the printed circuit board (PCB) can improve first-pass yield and reduce rework costs. Considering the impact of the PCB layout on the quality of solder paste printing, we propose a PCB layout-based spatiotemporal graph convolution network, in which we construct a graph to model the spatial distribution of solder pads. Specifically, since the printing quality is related to the spatial distribution of the pads, we convert the PCB to a graph according to the Pearson correlation of the printing quality and then trim the edges of the graph with a correlation threshold to model the spatial distribution of solder pads. To model the time-varying physicochemical properties of the solder paste, normalize the production time, calculate the attention of the production time, and reconstruct the printing quality based on the attention. Then, we devise a weighted loss to improve the performance of predicted printing of defective products due to the scarcity of defective products. Ultimately, the predicted printing quality is compared with the inspection threshold to estimate the degree of anomaly. The proposed method is validated on six days of real solder paste printing data, improving the average <inline-formula> <tex-math>$F1$ </tex-math></inline-formula> score by 0.057 and the average accuracy by 0.022 for three typical anomalous printing behaviors over two temporal prediction scales.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"214-223"},"PeriodicalIF":2.3,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0