IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第6页

Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications 优化线键合工艺以提高汽车应用中四平无铅封装的热机械性能

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-22 DOI: 10.1109/TCPMT.2025.3563367

Mei-Ling Wu;Che-Wei Kang

{"title":"Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications","authors":"Mei-Ling Wu;Che-Wei Kang","doi":"10.1109/TCPMT.2025.3563367","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3563367","url":null,"abstract":"This study investigates how local warpage and stress near the sawing lines of quad flat no-lead (QFN) packages, under stringent automotive conditions, influence the wire bonding process. A finite element model, validated through experimental measurements, was developed to quantify deformation and stress distributions along the cutting paths. Three lead frame strip designs—one row one block, multiblock, and one block—were comparatively assessed under both thermal and mechanical loads. Results show that the one row one block design can reduce local deformation by up to 70%–75% (e.g., <inline-formula> <tex-math>$45~mu $ </tex-math></inline-formula>m versus <inline-formula> <tex-math>$159~mu $ </tex-math></inline-formula>m) compared to the one block configuration, significantly mitigating alignment errors and fatigue risk. Concurrently, its peak local stress is about 212 MPa—a 70% reduction relative to the 708 MPa observed in the one block design. These combined improvements highlight the necessity of balanced structural design in sawing regions to enhance wire bonding stability. Overall, these findings provide a robust framework for optimizing QFN packages under stringent automotive conditions, particularly by refining wire bonding design.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 7","pages":"1417-1424"},"PeriodicalIF":2.3,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144581695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Enhanced Design of Airborne Radiation Sensor for Improved Survivability During Deployment Impact 提高机载辐射传感器在部署冲击中的生存能力的改进设计

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-22 DOI: 10.1109/TCPMT.2025.3563253

Pengcheng Yin;Jonghwan Ha;Junbo Yang;Karthik Deo;Yangyang Lai;Seungbae Park

{"title":"Enhanced Design of Airborne Radiation Sensor for Improved Survivability During Deployment Impact","authors":"Pengcheng Yin;Jonghwan Ha;Junbo Yang;Karthik Deo;Yangyang Lai;Seungbae Park","doi":"10.1109/TCPMT.2025.3563253","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3563253","url":null,"abstract":"By employing optimized outer packaging designs and materials, the impact energy can be effectively absorbed or dissipated, thereby preventing potential damage to interconnections and chips. This includes mitigating solder-joint fractures, chip cracks, pad cratering or lifting, and other mechanical stresses that commonly result from impact forces. To ensure that the internal ionic sensor remains resilient to moisture intrusion and can endure impact velocities of up to 30 mph, advanced packaging solutions have been developed. In this study, the ANSYS/LS-DYNA finite element analysis (FEAs) tool was utilized to evaluate the performance of various packaging designs in minimizing the shock energy transferred to the printed circuit board (PCB). Modifications were made to the external foam packaging to increase the effective thickness and stiffness of the PCB, thus limiting its deformation under impact. These adjustments involved testing several configurations, including a two-layer foam system, a single-layer foam, and variations in the foam material’s stress-strain characteristics. The results demonstrated a significant reduction in PCB deformation—by 86.9%—with the final design achieving a deformation of just <inline-formula> <tex-math>$52~mu $ </tex-math></inline-formula>m, compared to <inline-formula> <tex-math>$398.7~mu $ </tex-math></inline-formula>m in the initial design. Furthermore, the simulations of the final design were conducted for different drop orientations to ensure that out-of-plane deformations remained within the same order of magnitude, regardless of the drop direction.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 7","pages":"1410-1416"},"PeriodicalIF":2.3,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144623875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal Performance of Liquid-Cooled Metal Foams Attached Using Different Thermal Interface Materials 不同热界面材料连接液冷金属泡沫的热性能

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-17 DOI: 10.1109/TCPMT.2025.3561801

Ubade Kemerli;Yogendra Joshi

{"title":"Thermal Performance of Liquid-Cooled Metal Foams Attached Using Different Thermal Interface Materials","authors":"Ubade Kemerli;Yogendra Joshi","doi":"10.1109/TCPMT.2025.3561801","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3561801","url":null,"abstract":"This study experimentally and computationally investigates the convection heat transfer performance of metal foams (MFs) having the same pores per inch (PPI) but different porosities attached to a uniformly heated surface using three different thermal interface materials (TIMs). Of the three TIMs considered, flexible graphite showed the best heat transfer performance by around 10%–25% compared to the reference case, where no TIM was used, due to its high in-plane thermal conductivity. In contrast, thermal epoxy was the worst, with a decrease in heat transfer by around 10%–30%, relative to the reference case. A comparable performance to the reference case was exhibited by the thermal gap pad. The MF hydraulic modeling parameters were extracted from the pressure drop data, and pore and filament diameters were obtained from micro-CT (<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>CT) scans and used in the numerical simulations. Thermal contact resistances (TCRs) are assessed from the numerical simulations. The results showed that total TCR tends to increase with increasing filament diameter and decreasing porosity. Moreover, the steady-state thermal analyses showed that the flexible graphite effectively spreads the heat in the TIM and reduces the overall TCR. Detailed temperature contours on the heated surface of the thermal gap pad and flexible graphite TIMs used with different porosity MFs are presented to support these findings.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1179-1188"},"PeriodicalIF":2.3,"publicationDate":"2025-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144492242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Analytical and Optimal Strategy of Dynamic Current Balancing for Paralleled SiC MOSFETs With Cu-Clip Interconnection Considering Mutual Coupled Inductances 考虑互耦电感的并联SiC mosfet铜夹互连动态电流平衡分析及优化策略

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-16 DOI: 10.1109/TCPMT.2025.3561273

Xun Liu;Kun Ma;Yameng Sun;Yifan Song;Xiao Zhang;Anning Chen;Xuehan Li;Wei Huang;Huimin Shi;Miao Li;Yang Zhou;Sheng Liu

{"title":"Analytical and Optimal Strategy of Dynamic Current Balancing for Paralleled SiC MOSFETs With Cu-Clip Interconnection Considering Mutual Coupled Inductances","authors":"Xun Liu;Kun Ma;Yameng Sun;Yifan Song;Xiao Zhang;Anning Chen;Xuehan Li;Wei Huang;Huimin Shi;Miao Li;Yang Zhou;Sheng Liu","doi":"10.1109/TCPMT.2025.3561273","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3561273","url":null,"abstract":"To enhance the electrical performance and reliability of silicon carbide (SiC) power modules, the study explores Cu-clip as a promising alternative to traditional Al-wire interconnections. SiC power modules, particularly in parallel configurations, encounter challenges in optimizing dynamic current-sharing performance, which limits their maximum current capacity and reliability during switching events. This study proposes an innovative layout design for SiC MOSFET modules, utilizing a coupled parasitic inductance network model to capture better the impact of mutual inductances on dynamic current imbalance. The model derives an equation for equivalent source inductances, accounting for both self-inductance and mutual inductance, providing a foundation for optimizing the layout to minimize dynamic current imbalance. Based on this model, a new Cu-clip structure is designed along with a mathematical analysis aimed at reducing disparities in equivalent source inductances, thereby enhancing dynamic current balancing. The distance between the dies is also increased to mitigate thermal coupling effects. Double-pulse tests and simulations were performed to validate the dynamic current balancing performance of the fabricated power module. The results show a 40% reduction in dynamic current imbalance for the optimized layout (layout B) compared to the baseline configuration (layout A). This work presents a comprehensive solution to improve the dynamic current performance of paralleled SiC MOSFET power modules, offering significant contributions to the design of more efficient and reliable power electronics.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1189-1202"},"PeriodicalIF":2.3,"publicationDate":"2025-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144492232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits 光子集成电路的混合模光纤阵列对准与耦合

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-15 DOI: 10.1109/TCPMT.2025.3560722

Kamil Gradkowski

引用次数: 0

Synthesis Design of Low-Loss and Self-Packaged Bandpass Filter on λ/4 SISL Resonators Using the Short-Open-Load (SOL) Technique 基于短开载（SOL）技术的λ/4 SISL谐振器低损耗自封装带通滤波器综合设计

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-15 DOI: 10.1109/TCPMT.2025.3560983

Shuangxu Li;Lei Zhu;Kaixue Ma

{"title":"Synthesis Design of Low-Loss and Self-Packaged Bandpass Filter on λ/4 SISL Resonators Using the Short-Open-Load (SOL) Technique","authors":"Shuangxu Li;Lei Zhu;Kaixue Ma","doi":"10.1109/TCPMT.2025.3560983","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3560983","url":null,"abstract":"In this article, an efficient and accurate synthesis design method for bandpass filters (BPFs) based on low-loss quarter-wavelength (<inline-formula> <tex-math>$lambda $ </tex-math></inline-formula>/4) substrate integrated suspended line (SISL) resonators is proposed, using the short-open-load (SOL) calibration technique. The BPF topology is comprised of SISL with two volumes of vias on both side walls and alternating SISL-based <italic>J/<italic>K inverters. First, with the help of full-wave simulation, the propagation characteristics of the SISL with periodically loaded pins are analyzed and extracted by SOL. Afterward, to facilitate the filter synthesis design, the equivalent circuit parameters of each <italic>J/<italic>K inverter with symmetrical/asymmetrical feed lines are accurately extracted. Herein, the extra transition for circuit measurement can be directly merged into the input port of the <inline-formula> <tex-math>$J_{01}$ </tex-math></inline-formula> inverter and then be regarded as an error box to be calibrated out by SOL. Therefore, the efficient co-design of the resultant SISL BPF containing the feed transition can be achieved. Finally, two 4th-order all-pole Chebyshev SISL BPFs with <inline-formula> <tex-math>$lambda $ </tex-math></inline-formula>/4 resonators are designed and fabricated. The synthesized, simulated, and measured results of all the implemented SISL BPFs are found in good agreement, evidently demonstrating the effectiveness of the SOL technique for designing the SISL circuits. In addition, the SISL BPFs have the advantages of low loss and self-packaging against traditional planar BPFs.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1328-1336"},"PeriodicalIF":2.3,"publicationDate":"2025-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144492317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-11 DOI: 10.1109/TCPMT.2025.3553729

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IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-11 DOI: 10.1109/TCPMT.2025.3553727

引用次数: 0

IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information 电气和电子工程师学会《部件、封装和制造技术》杂志出版信息

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-11 DOI: 10.1109/TCPMT.2025.3553725

引用次数: 0

Wirebond Corrosion Failure of Plastic Packages in Extreme Environments: Theory and Experiment 塑料封装在极端环境下的线键腐蚀失效：理论与实验

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-10 DOI: 10.1109/TCPMT.2025.3559525

M. Asaduz Zaman Mamun;Amar Mavinkurve;René Rongen;Michiel van Soestbergen;Muhammad A. Alam

{"title":"Wirebond Corrosion Failure of Plastic Packages in Extreme Environments: Theory and Experiment","authors":"M. Asaduz Zaman Mamun;Amar Mavinkurve;René Rongen;Michiel van Soestbergen;Muhammad A. Alam","doi":"10.1109/TCPMT.2025.3559525","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3559525","url":null,"abstract":"Since the 1950s, and continuing to the present day, wirebond (WB) has remained the most popular interconnection technology. WB is known for its cost-effectiveness, proven reliability, and ease of processing. WB process has advanced significantly with modern developments, such as full automation and optimization of epoxy mold compounds (EMCs). However, mainstream CuAl WB contacts are susceptible to corrosion failures, triggered by the transport and localization of ionic species within the EMCs. The failure is primarily driven by applied bias but exacerbated by environmental factors, such as high relative humidity (RH) and temperature (<italic>T). In this scenario, a physics-based generalized failure model for WB corrosion has the potential to offer a robust and standardized qualification approach, streamline the testing process, and facilitate any future WB scaling. In this study, we: i) investigate the in situ ion migration behavior in the EMC using our proposed leakage current-based strategy; ii) simulate and analytically approximate the transient space charge accumulation in the WB-EMC interface; iii) integrate the insights from the simulations and the assumption of a first-order redox reaction into a failure distribution model; and iv) validate the model with integrated circuit (IC) failure data from accelerated tests. The resulting model would serve as a versatile predictive tool for qualifying WB technology.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1213-1221"},"PeriodicalIF":2.3,"publicationDate":"2025-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144492363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0