Millimeter-Wave On-Chip Ultrawideband Bandpass Filter on Coupled Line Based Bi-Path Topology Using GaAs Technology

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhuowei Zhang;Gang Zhang;Kam-Weng Tam;Xin Zhou;Shichang Chen
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引用次数: 0

Abstract

In this article, using gallium arsenide (GaAs) technology, a revolutionary millimeter-wave on-chip ultrawideband (UWB) bandpass filter (BPF) with greatly enhanced operation performance is demonstrated for the first time. By utilizing quarter wavelength short-circuited lines with an open-circuited interdigital coupled line and a short-circuited combine coupled line, it is altered from the traditional wideband BPF structure to create a flexible coupled line based bi-path topology. In comparison to the traditional structure, the suggested topology can efficiently increase passband selectivity with more flexible transmission zeros (TZs), as well as two more transmission poles (TPs) for a flatter UWB passband and a larger return loss (RL) bandwidth. For verification, an on-chip UWB BPF prototype using 0.25- $\mu $ m GaAs pHEMT technology is designed, fabricated, and measured. The measurements show that it has a center frequency of 45.3 GHz with a fractional bandwidth (FBW) of 135%. A good agreement is found between the simulated and measured data.
本文利用砷化镓(GaAs)技术,首次展示了一种革命性的毫米波片上超宽带(UWB)带通滤波器(BPF),其工作性能大大提高。通过利用四分之一波长短路线、开路数字间耦合线和短路组合耦合线,它改变了传统的宽带 BPF 结构,创建了一种基于耦合线的灵活双路径拓扑结构。与传统结构相比,所建议的拓扑结构能有效提高通带选择性,具有更灵活的传输零点(TZ),以及两个更多的传输极点(TP),从而实现更平坦的 UWB 通带和更大的回波损耗(RL)带宽。为了进行验证,我们设计、制造并测量了采用 0.25- $\mu $ m GaAs pHEMT 技术的片上 UWB BPF 原型。测量结果表明,它的中心频率为 45.3 GHz,分数带宽 (FBW) 为 135%。模拟数据和测量数据之间具有良好的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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