IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2025.3553729","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3553729","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10964035","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143824557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2025.3553725","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3553725","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2025-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10964063","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143820334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2025.3553727","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3553727","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"884-884"},"PeriodicalIF":2.3,"publicationDate":"2025-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10964062","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143824565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2025.3546007","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3546007","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"631-631"},"PeriodicalIF":2.3,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10935769","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2025.3546009","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3546009","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10935768","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2025.3546005","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3546005","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10935767","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules","authors":"Xiaofan Jia;Xingchen Li;Joon Woo Kim;Kyoung-Sik Moon;Mark J. W. Rodwell;Madhavan Swaminathan","doi":"10.1109/TCPMT.2025.3549371","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3549371","url":null,"abstract":"This article presents an innovative antenna-in-package (AiP) solution designed for 140-GHz indium phosphide (InP) power amplifier (PA) front-end modules. In this design, InP PAs are strategically embedded at the center of a glass substrate (AGC EN-A1) sandwiched by low-loss dielectric layers (ABF-GL102) on both sides. This arrangement facilitates ultrashort die-to-package interconnects through 20-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m dielectric vias, achieving a remarkably low simulated loss of 0.2–0.3 dB at 140 GHz and an impressive <inline-formula> <tex-math>$S11$ </tex-math></inline-formula>/<inline-formula> <tex-math>$S22$ </tex-math></inline-formula> of less than −15 dB across a wide frequency range from 110 to 170 GHz. We conducted a thorough evaluation of various PA designs with two-stage and three-stage amplifying circuits embedded within this package. The findings reveal that the embedded InP PAs deliver consistent small signal gains of 11.1 dB for the two-stage and 15.8 dB for the three-stage PAs at 140 GHz, comparable with their bare die performance and other existing packaging technologies. A key feature of this design is the integration of a 5-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m-thick copper heat spreader on the PA backside, which significantly enhances thermal management. In addition, the design accommodates the seamless integration of a <inline-formula> <tex-math>$1times 8$ </tex-math></inline-formula> microstrip patch antenna array. Directly connected to the PA output, this array achieves maximum broadside gains of 12.9, 25.3, and 29.7 dB for the standalone antenna, and the PA-antenna modules with two-stage and three-stage PAs at 139 GHz, respectively, over a 3-dB bandwidth of 5 GHz (136–141 GHz). Moreover, the radiation pattern of the PA-antenna module has been meticulously characterized, showcasing a <inline-formula> <tex-math>$13^{circ } ~3$ </tex-math></inline-formula>-dB <italic>E</i>-plane beamwidth and <inline-formula> <tex-math>$64^{circ } ~3$ </tex-math></inline-formula>-dB <italic>H</i>-plane beamwidth from the broadside. With its superior electrical and thermal performance, scalability, and cost-effectiveness, this package presents a promising solution for developing D-band beamforming arrays in next-generation communication systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"782-791"},"PeriodicalIF":2.3,"publicationDate":"2025-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143821669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology","authors":"Tian Yu;Xin Chen;Manyu Wang;Qing Zhou;Jing-Yu Lin;Daquan Yu","doi":"10.1109/TCPMT.2025.3549037","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3549037","url":null,"abstract":"In this letter, a series of on-chip millimeter-wave (mm-W) notch-band half-mode substrate integrated plasmonic waveguide (HMSIPW) filters based on wafer-level through glass via (TGV) technology are realized, which features wideband and ultralow loss. Based on the analysis of the dispersion characteristics of the HMSIPW unit, the design mechanism of the single-band HMSIPW filter is studied. Furthermore, this work proposes the first integration of complementary split-ring resonator (CSRR)-based defected ground structure (DGS) with HMSIPW through TGV technology, enabling compact and tunable notch-band filtering in the mm-W regime. The unique combination of glass substrate and spoof surface plasmon polaritons (SSPPs) achieves ultralow insertion loss and independent control of center frequencies and bandwidths (BWs), surpassing prior works in both miniaturization and functional flexibility. To validate the proposed design methodology, three glass-based HMSIPW filter prototypes are fabricated and tested. The results show a good filtering performance. The number of notch band can be changed by adjusting the parameters of CSRR. The center frequencies and BWs can also be independently controlled. The proposed HMSIPW filters with good performance may have potential applications in mm-W wireless communication systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"880-883"},"PeriodicalIF":2.3,"publicationDate":"2025-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143824570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Smartphone Antenna on Display (AoD) Design at Millimeter-Wave Frequencies With Enhanced Transparency and Ground Plane","authors":"Hsi-Tseng Chou;Chen-Yi Chang;Chao-Wei Yeh;Yu-Ling Yeh;Yu-En Liu","doi":"10.1109/TCPMT.2025.3548459","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3548459","url":null,"abstract":"Antenna on display (AoD) for user equipment (UE) is attractive but faces challenges in implementation. Key factors impacting the AoD implementation are examined in this article. To illustrate the basic behaviors and demonstrate its feasibility, a <inline-formula> <tex-math>$1times 4$ </tex-math></inline-formula> optically invisible antenna array is designed, fabricated, and implemented on a display panel at a 5G millimeter-wave (mm-wave) frequency band of 28 GHz. Metal mesh is used as a conductor in the antenna design to provide a high transmittance of around 88%. Novel dummy metal grids of electromagnetic (EM) transparency are added around antennas to increase the optical invisibility of AoD. Moreover, an mm-wave beamforming board and a feeding network on a flexible printed circuit (FPC) board are implemented to emulate the actual scenario for the AoD design. The maximum antenna gain of 7.36 dBi for a <inline-formula> <tex-math>$1times 4$ </tex-math></inline-formula> optically invisible antenna array has been achieved with the scanning range between ±30°.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"632-639"},"PeriodicalIF":2.3,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143820335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An Integrated Multioutput Classification-Based Defect Diagnosis Model for Pick-and-Place Machines","authors":"Yuqiao Cen;Jingxi He;Daehan Won","doi":"10.1109/TCPMT.2025.3548548","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3548548","url":null,"abstract":"Surface mount technology (SMT) is a method to mount components directly onto printed circuit boards (PCBs) and is widely used in low-cost and high-density electronic assemblies. Pick-and-place (P&P) is a core procedure for component placing after the solder paste printing (SPP) process in SMT. Generally, the industry uses an automated optical inspection (AOI) machine to detect defects after the components are mounted. However, the AOI machine cannot discern the failures’ root causes and offer reliable P&P machine maintenance references. With the advent of Industry 4.0, machine learning (ML) methods can be applied to improve production line maintenance. Therefore, the traditional check-up process can be changed into a data-driven, predictive, and condition-based maintenance process. Production efficiency can be significantly increased. In this article, a multioutput classification-based defect diagnosis (MCDD) model has been developed to trace the root causes of defects by using the patterns discovered from the experiment data. The experiments with initial machine errors are conducted and investigation information is collected. Compared with the traditional root cause identification model, the developed model is easier to adjust and can achieve an overall classification accuracy of 84.5%. Furthermore, the transfer learning method has been used to apply the trained model for one component to other components and can achieve an accuracy of 81.74%.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 4","pages":"842-849"},"PeriodicalIF":2.3,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143821844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}