发布求助
文献互助 智能选刊 最新文献

IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献

筛选
英文 中文
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-22 DOI: 10.1109/TCPMT.2025.3527349
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2025.3527349","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3527349","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10850520","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Foreword: Special Section on “Novel Design Methodologies to Address the Challenges of Modern-Day Chip-Package-System Integration” 前言：“解决现代芯片封装系统集成挑战的新设计方法”专题部分
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-22 DOI: 10.1109/TCPMT.2024.3518872
Antonio Maffucci;Swagato Chakraborty;Rajen Murugan
{"title":"Foreword: Special Section on “Novel Design Methodologies to Address the Challenges of Modern-Day Chip-Package-System Integration”","authors":"Antonio Maffucci;Swagato Chakraborty;Rajen Murugan","doi":"10.1109/TCPMT.2024.3518872","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3518872","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"1-3"},"PeriodicalIF":2.3,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10850518","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-22 DOI: 10.1109/TCPMT.2025.3527355
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2025.3527355","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3527355","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"235-235"},"PeriodicalIF":2.3,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10850519","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-22 DOI: 10.1109/TCPMT.2025.3527353
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2025.3527353","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3527353","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10850497","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992905","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14 IEEE组件，封装和制造技术汇刊，第14卷
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-07 DOI: 10.1109/TCPMT.2025.3527171
{"title":"2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14","authors":"","doi":"10.1109/TCPMT.2025.3527171","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3527171","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2407-2463"},"PeriodicalIF":2.3,"publicationDate":"2025-01-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10832478","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142938285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3511826
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3511826","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3511826","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10823081","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142925436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3511822
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3511822","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3511822","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10821527","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Access Publishing IEEE开放获取出版
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3521135
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TCPMT.2024.3521135","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3521135","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2406-2406"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10823078","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142925348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! techxiv：与世界分享你的预印本研究！
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3521133
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3521133","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3521133","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2405-2405"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10821525","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142925392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology 感谢IEEE元器件、封装与制造技术汇刊的审稿人
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3517192
{"title":"Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology","authors":"","doi":"10.1109/TCPMT.2024.3517192","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3517192","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2147-2153"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10823080","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信