IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献

IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-09-16 DOI: 10.1109/TCPMT.2025.3602195

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Foreword: Special Section on Advances in Design, Modeling, and Simulation Methodologies for Modern Chip-Package-System Integration 前言：关于现代芯片封装系统集成的设计、建模和仿真方法的进展的特别部分

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-09-16 DOI: 10.1109/TCPMT.2025.3598876

Antonio Maffucci;Mihai Telescu

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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-09-16 DOI: 10.1109/TCPMT.2025.3602199

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IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-09-16 DOI: 10.1109/TCPMT.2025.3602197

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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-22 DOI: 10.1109/TCPMT.2025.3593032

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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-22 DOI: 10.1109/TCPMT.2025.3593037

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Foreword: Frontiers of Photonic Integration and Packaging 前言：光子集成与封装前沿

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-22 DOI: 10.1109/TCPMT.2025.3591951

Hiren D. Thacker;Stéphane Bernabé;Richard Pitwon

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Stable HIPPO-Based Circuit Macro-Modeling 基于稳定hippo的电路宏观建模

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-11 DOI: 10.1109/TCPMT.2025.3597811

Bijan Shahriari;Roni Khazaka

{"title":"Stable HIPPO-Based Circuit Macro-Modeling","authors":"Bijan Shahriari;Roni Khazaka","doi":"10.1109/TCPMT.2025.3597811","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3597811","url":null,"abstract":"Behavioral modeling of analog circuits is an important step of the integrated circuit design flow. Indeed, closed-box behavior modeling allows users to replicate the behavior of circuit elements and devices without explicitly knowing the inner workings of the device. Prior works have automated the generation of behavioral models using machine learning (ML) at both the device and circuit level. More specifically, a recent work has used high-order polynomial projection operators (HIPPOs) to augment gated recurrent unit (GRU)-based macro-models. This new HIPPO-based model has been shown to outperform state-of-the-art GRU-based circuit macro-models. In this article, we introduce a new type of modified recurrent neural network (RNN) circuit macro-model that uses the HIPPO framework, called HIPPO-RNN. Additionally, we present a modified HIPPO-RNN (stable-HIPPO-RNN) model that is more suitable for enforcing input-to-state stability (ISS), and derive corresponding stability constraints. These constraints effectively guarantee ISS stability of the macro-model during transient simulation. We show the validity and superior performance of our macro-models on two circuit modeling examples.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1823-1835"},"PeriodicalIF":3.0,"publicationDate":"2025-08-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels spice -兼容非线性行为宏模型的生成

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-11 DOI: 10.1109/TCPMT.2025.3597771

Antonio Carlucci;Ion Victor Gosea;Stefano Grivet-Talocia

{"title":"On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels","authors":"Antonio Carlucci;Ion Victor Gosea;Stefano Grivet-Talocia","doi":"10.1109/TCPMT.2025.3597771","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3597771","url":null,"abstract":"This article presents a complete framework for the generation of behavioral macromodels of a wide class of nonlinear components, devices, and systems. The model structure and related identification algorithms are based on the Volterra series formulated in the frequency domain through multivariate generalized transfer functions (GTFs). A multivariate rational model is first estimated in pole-residue form from sampled responses and then converted to a bilinear state-space form. The main novel contribution of this work is the SPICE-compatible circuit synthesis, which enables the usage of nonlinear macromodels within circuit simulation environments as part of more complex system-level simulations. Examples are provided for a low dropout voltage regulator and a system-level power distribution network embedding integrated regulators. For such examples, the proposed SPICE equivalents offer speedup factors ranging from <inline-formula> <tex-math>$12times $ </tex-math></inline-formula> up to <inline-formula> <tex-math>$650times $ </tex-math></inline-formula> with negligible loss in accuracy.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1857-1867"},"PeriodicalIF":3.0,"publicationDate":"2025-08-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Relational SI/PI-Database for a Data-Driven Approach to PCB Design Automation and Performance Prediction 关系型SI/ pi数据库用于PCB设计自动化和性能预测的数据驱动方法

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-11 DOI: 10.1109/TCPMT.2025.3597840

Til Hillebrecht;Tommy Weber;Johannes Alfert;Christian Schuster

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