spice -兼容非线性行为宏模型的生成

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Antonio Carlucci;Ion Victor Gosea;Stefano Grivet-Talocia
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引用次数: 0

摘要

本文提出了一个完整的框架,用于生成广泛的非线性组件、设备和系统的行为宏模型。模型结构和相关的识别算法是基于通过多元广义传递函数(GTFs)在频域形成的Volterra级数。首先从抽样响应中估计出极点残差形式的多元理性模型,然后将其转换为双线性状态空间形式。这项工作的主要新颖贡献是spice兼容电路合成,它可以在电路仿真环境中使用非线性宏模型作为更复杂的系统级仿真的一部分。提供了低差电压调节器和嵌入集成调节器的系统级配电网的实例。对于这样的例子,提出的SPICE等价物提供的加速因子从12美元到650美元不等,精度损失可以忽略不计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels
This article presents a complete framework for the generation of behavioral macromodels of a wide class of nonlinear components, devices, and systems. The model structure and related identification algorithms are based on the Volterra series formulated in the frequency domain through multivariate generalized transfer functions (GTFs). A multivariate rational model is first estimated in pole-residue form from sampled responses and then converted to a bilinear state-space form. The main novel contribution of this work is the SPICE-compatible circuit synthesis, which enables the usage of nonlinear macromodels within circuit simulation environments as part of more complex system-level simulations. Examples are provided for a low dropout voltage regulator and a system-level power distribution network embedding integrated regulators. For such examples, the proposed SPICE equivalents offer speedup factors ranging from $12\times $ up to $650\times $ with negligible loss in accuracy.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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