IEEE Transactions on Components, Packaging and Manufacturing Technology

SCI期刊

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中科院SCI期刊分区 WOS期刊分区历年影响因子历年发表同类期刊

中文名称：

元件封装与制造技术IEEE Transactions

期刊缩写：

IEEE T COMP PACK MAN

影响因子：

ISSN：

print: 2156-3950

研究领域：

ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

创刊年份：

2011年

h-index：

自引率：

13.60%

Gold OA文章占比：

11.38%

原创研究文献占比：

100.00%

SCI收录类型：

Science Citation Index Expanded (SCIE) || Scopus (CiteScore)

期刊官网：

https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT

期刊介绍英文：

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

CiteScore：

CiteScore	SJR	SNIP	CiteScore排名
4.7	0.562	1.119	学科排名百分位大类：Engineering 小类：Industrial and Manufacturing Engineering 123 / 384 68% 大类：Engineering 小类：Electrical and Electronic Engineering 283 / 797 64% 大类：Materials Science 小类：Electronic, Optical and Magnetic Materials 108 / 284 62%

发文信息

中科院SCI期刊分区

2025年3月20日发布

大类	小类	TOP期刊	综述期刊
3区工程技术	3区工程：电子与电气 ENGINEERING, ELECTRICAL & ELECTRONIC 4区工程：制造 ENGINEERING, MANUFACTURING 3区材料科学：综合 MATERIALS SCIENCE, MULTIDISCIPLINARY	否	否

2023年12月发布

大类	小类	TOP期刊	综述期刊
3区工程技术	3区工程：电子与电气 ENGINEERING, ELECTRICAL & ELECTRONIC 3区材料科学：综合 MATERIALS SCIENCE, MULTIDISCIPLINARY 4区工程：制造 ENGINEERING, MANUFACTURING	否	否