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Aerosol-Jet Printed Transferable Millimeter-Wave Circuits 气溶胶喷射打印可转移毫米波电路
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-13 DOI: 10.1109/TCPMT.2024.3460655
Wesley Spain;John Papapolymerou;Prem Chahal;Matthew Hodek;John D. Albrecht
{"title":"Aerosol-Jet Printed Transferable Millimeter-Wave Circuits","authors":"Wesley Spain;John Papapolymerou;Prem Chahal;Matthew Hodek;John D. Albrecht","doi":"10.1109/TCPMT.2024.3460655","DOIUrl":"10.1109/TCPMT.2024.3460655","url":null,"abstract":"Printed millimeter-wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-D heterogeneous integration (3DHI) to improve performance beyond traditional systems. In this article, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A polydimethylsiloxane (PDMS) stamp-assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142248862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! TechRxiv：与世界分享您的预印本研究成果！
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-12 DOI: 10.1109/TCPMT.2024.3456649
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3456649","DOIUrl":"10.1109/TCPMT.2024.3456649","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10679205","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators 使用可切换双模混合谐振器的高选择性带通滤波器集成 SPDT 开关
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-12 DOI: 10.1109/TCPMT.2024.3459639
Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che
{"title":"High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators","authors":"Na Ji;Guangxu Shen;Wenjie Feng;Quan Xue;Wenquan Che","doi":"10.1109/TCPMT.2024.3459639","DOIUrl":"10.1109/TCPMT.2024.3459639","url":null,"abstract":"This article proposes a high-selectivity bandpass filter-integrated single-pole double-throw (SPDT) switch based on switchable dual-mode hybrid resonators. To solve the intrinsic conflict between the high ON-state loss and high OFF-state suppression (OSS), a switchable dual-mode hybrid resonator with two resonant modes constructed by 16-mode SIW, microstrip stub, and PIN diode is proposed. The PIN diode loaded on the open end of the 16-mode SIW is used to switch the resonant state. To enhance the isolation between the ON and OFF channels, a common coupled feed line is used to provide two identical coupling paths, mitigating the impedance impact from the OFF-state channel. In addition, by adjusting the structural parameters of the proposed resonator, the transmission zeros (TZs) of the switch can be controlled independently. For theoretical analysis, the equivalent circuit modeling for the SPDT switch is investigated. Based on the equivalent circuit, the frequencies of TZs are calculated. For experimental verification, the second-order BPF-integrated SPDT switch at center frequency \u0000<inline-formula> <tex-math>$f_{0} =4.9$ </tex-math></inline-formula>\u0000 GHz with ripple bandwidth 400 MHz is designed, fabricated, and measured. Low insertion loss of only 1.18 dB, high upper stopband suppression, and multiple transmission zeroes are realized.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information 电气和电子工程师学会《部件、封装和制造技术》期刊 出版信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3447513
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3447513","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3447513","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676338","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142169747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Member Get-a-Member (MGM) Program 会员注册（MGM）计划
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3458549
{"title":"Member Get-a-Member (MGM) Program","authors":"","doi":"10.1109/TCPMT.2024.3458549","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3458549","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676337","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142169728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 电气和电子工程师学会《元件、封装和制造技术》学会信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3447519
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3447519","DOIUrl":"10.1109/TCPMT.2024.3447519","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676334","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142220029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Access Publishing IEEE 开放存取出版
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3456651
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TCPMT.2024.3456651","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3456651","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676336","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142173982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! TechRxiv：与世界分享您的预印本研究成果！
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3453124
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3453124","DOIUrl":"10.1109/TCPMT.2024.3453124","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676335","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142219833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE 《部件、封装和制造技术》期刊 为作者提供的信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3447517
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3447517","DOIUrl":"10.1109/TCPMT.2024.3447517","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676332","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142219832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Member Get-a-Member (MGM) Program 会员注册（MGM）计划
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-09-11 DOI: 10.1109/TCPMT.2024.3453168
{"title":"Member Get-a-Member (MGM) Program","authors":"","doi":"10.1109/TCPMT.2024.3453168","DOIUrl":"10.1109/TCPMT.2024.3453168","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10676333","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142219837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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