IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第2页

Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes 叠层双色微发光二极管的杂化键合技术

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-04 DOI: 10.1109/TCPMT.2025.3595581

Wen-Ching Hung;Jui-Fu Chang;Sheng-Po Chang;Shoou-Jinn Chang;Jyh-Chen Chen

{"title":"Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes","authors":"Wen-Ching Hung;Jui-Fu Chang;Sheng-Po Chang;Shoou-Jinn Chang;Jyh-Chen Chen","doi":"10.1109/TCPMT.2025.3595581","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3595581","url":null,"abstract":"In this work, a vertically stacked bi-color micro-light-emitting diode (Micro-LED) array structure employing Au–Sn hybrid bonding technology is presented. The design integrates blue flip-chip and green vertical Micro-LEDs into a common cathode circuit configuration, achieving an ultrafine pixel pitch of <inline-formula> <tex-math>$5~mu $ </tex-math></inline-formula>m across <inline-formula> <tex-math>$343times 387$ </tex-math></inline-formula> array on 1.6-cm2 substrate. Precise hybrid bonding was performed at <inline-formula> <tex-math>$233~^{circ }$ </tex-math></inline-formula>C for 30 min, enabling effective Au–Sn alloy formation. The structure’s performance was verified through electrical character and cross-sectional SEM-EDX analysis, demonstrating minimal voltage increase postbonding and confirming the feasibility of independent control for both colors. This integration approach provides a scalable solution for high resolution, compact, and low-power consumption. The Micro-LEDs display applications, particularly suited for near-eye devices such as augmented and virtual reality systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1886-1889"},"PeriodicalIF":3.0,"publicationDate":"2025-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Investigation of a Novel Symmetric-Structure-Based MEMS Piezoresistive Accelerometer 一种新型对称结构MEMS压阻式加速度计的研究

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-08-04 DOI: 10.1109/TCPMT.2025.3595152

Satyapal Singh;Vijay Kumar;Navin Kumar

{"title":"Investigation of a Novel Symmetric-Structure-Based MEMS Piezoresistive Accelerometer","authors":"Satyapal Singh;Vijay Kumar;Navin Kumar","doi":"10.1109/TCPMT.2025.3595152","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3595152","url":null,"abstract":"In this article, a novel symmetric-structure-based silicon microelectromechanical systems (MEMS) piezoresistive accelerometer is proposed. Compared to conventional structures based on multiple support beams and hanging-seismic-mass, the symmetric-structure not only reduces cross-axis output but also ensures lower stresses in the flexures when subjected to cross-axis acceleration inputs. It increases the ratio of the fracture acceleration limit in the cross-direction to that in the sense-direction, from approximately 5.8 to 24. Additionally, it improves the ratio of the second to the first mode resonance frequency from approximately 2.2 to 10.5, which can improve survivability of the structure over a much wider bandwidth against resonance of the second mode. The new structure was fabricated by bonding two silicon-on-insulator (SOI) wafers, each containing complementary halves of the structure. This article presents the configuration details of the structure, along with analytical and finite element analysis (FEA) results to estimate deflections, stresses, modal frequencies, and mode shapes. Additionally, the MEMS fabrication process details, packaging, and test results of X-ray imaging, scanning electron microscope (SEM) imaging, natural frequency measurement using laser doppler vibrometer (LDV), sensitivity test, and so on, at die and package level are discussed.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1868-1876"},"PeriodicalIF":3.0,"publicationDate":"2025-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Analysis of Bondwires and RF Compensation Circuits in E-Band e波段键合线及射频补偿电路分析

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-31 DOI: 10.1109/TCPMT.2025.3594505

Sumin David Joseph;Edward A. Ball

{"title":"Analysis of Bondwires and RF Compensation Circuits in E-Band","authors":"Sumin David Joseph;Edward A. Ball","doi":"10.1109/TCPMT.2025.3594505","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3594505","url":null,"abstract":"This article investigates the impact of bondwire interconnections on signal integrity in low and high millimeter-wave (mmWave) applications, emphasizing transmission degradation caused by inductive and parasitic effects. Through detailed measurements and analysis, we demonstrate that transmission loss and impedance mismatches can be effectively reduced by minimizing bondwire length and using multiple wires in parallel. Based on empirical data, we developed an electrical model of bondwire incorporating distributed inductance, capacitance, resistance <inline-formula> <tex-math>$(L/C/R)$ </tex-math></inline-formula>, and transmission line characteristics. To further enhance performance, we introduce compact compensation circuits using <italic>LC structures and radial stubs optimized for both single and double bondwire configurations. Experimental validation shows that the proposed double-wire <italic>LC compensation technique significantly reduces insertion loss—from 5 to 1.5 dB and provides a return loss bandwidth from 70 to 75 GHz. The key novelty of this work lies in integrating multiple bondwires with low complexity, compact <italic>LC compensation structures, providing an effective solution for reducing insertion loss and improving impedance matching in mmWave systems. This approach offers a practical and scalable solution for improving chip-to-board and board-to-board interconnect performance in mmWave systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1986-1995"},"PeriodicalIF":3.0,"publicationDate":"2025-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET WBG SiC MOSFET三维PCB组件中焊点分层起始检测方法

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-30 DOI: 10.1109/TCPMT.2025.3593891

Souhila Bouzerd;Laurent Dupont

{"title":"A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET","authors":"Souhila Bouzerd;Laurent Dupont","doi":"10.1109/TCPMT.2025.3593891","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3593891","url":null,"abstract":"This article presents and discusses a method for evaluating the initiation of a solder joint delamination in a 3-D power electronics assembly of SiC MOSFETs integrated into printed circuit board substrate to design a more efficient half bridge. This assembly requires soldering two metallic parts and addresses the integration of active chips with small dimensions compared to the larger heat-sink dimensions to operate only with a convective cooling system. This technological development is part of an effort to assess the robustness of technological choices for a new assembly model of wide bandgap components. However, the conventional methods do not effectively meet the need for detecting the initiation of solder delamination due to the optimized electrothermal assembly design. The method relies on potential difference measurements that exhibit greater sensitivity to detect the onset of solder delamination. Finite element simulations are carried out to assess the method’s sensitivity and discriminating factors, such as geometry and materials involved. Based on the numerical results, the dedicated prototypes of the assembly are developed with controlled delamination rates at the solder joint corners. The results demonstrate that this method is sensitive to detect low delamination rates compared to the traditional method. An improvement of the PCB copper design is made by adding a routing to improve the robustness and the reliability of the method sensitivity.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"2041-2048"},"PeriodicalIF":3.0,"publicationDate":"2025-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145073372","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An Efficient Modeling Method for Multiphysics Analysis of 3-D Interconnects 三维互连多物理场分析的高效建模方法

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-29 DOI: 10.1109/TCPMT.2025.3593614

Yue Pan;Tian Xia;Yu Mao Wu

{"title":"An Efficient Modeling Method for Multiphysics Analysis of 3-D Interconnects","authors":"Yue Pan;Tian Xia;Yu Mao Wu","doi":"10.1109/TCPMT.2025.3593614","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3593614","url":null,"abstract":"As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently multiphysics, multiscale, and large in computational scale. This article addresses these challenges by developing an electrical–thermal–mechanical co-simulation based on the discontinuous Galerkin finite-element method (DG-FEM). The governing equations for the three fields are formulated in a unified manner, enabling their effective solutions through a single DG-FEM framework. Since DG-FEM naturally supports the handling of nonconformal meshes, the mesh generation process is significantly simplified when handling multiscale models. Furthermore, a GPU parallel acceleration technique is applied to improve computational efficiency for large computational problems. The capability of the method in performing multiphysics simulations is demonstrated by several numerical examples of interconnect structures, achieving GPU speedups of over 20 times. Through simulations, detailed temperature and local stress distributions are efficiently obtained, providing critical insights into interconnect reliability.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1921-1931"},"PeriodicalIF":3.0,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Encapsulation of ZrO2 Nanoparticles for Improving Total Luminous Flux of White Light-Emitting Diodes ZrO2纳米粒子封装提高白光二极管总光通量

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-25 DOI: 10.1109/TCPMT.2025.3592673

Tomoaki Kashiwao;Ryo Takeda;Tomomi Ito

{"title":"Encapsulation of ZrO2 Nanoparticles for Improving Total Luminous Flux of White Light-Emitting Diodes","authors":"Tomoaki Kashiwao;Ryo Takeda;Tomomi Ito","doi":"10.1109/TCPMT.2025.3592673","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3592673","url":null,"abstract":"In recent years, white light-emitting diodes (LEDs) have gained traction in general lighting and displays owing to their energy efficiency and high performance. Zirconium dioxide (ZrO<inline-formula> <tex-math>${}_{{2}}$ </tex-math></inline-formula>) nanoparticles, characterized by high refractive indices, can significantly improve the luminous efficiency of white LEDs. When integrated into the encapsulation resin of white LED packaging (PKG), a small quantity of these nanoparticles effectively scatters the light emitted by the LED chip, thereby enhancing light extraction from the PKG. A ray-tracing simulation was employed to study the optical behavior of ZrO<inline-formula> <tex-math>${}_{{2}}$ </tex-math></inline-formula> nanoparticles within white LED PKG. Subsequently, the distribution of the ZrO<inline-formula> <tex-math>${}_{{2}}$ </tex-math></inline-formula> nanoparticles was optimized, and the mechanism underlying the enhanced luminosity was analyzed. The simulation results reveal that ZrO<inline-formula> <tex-math>${}_{{2}}$ </tex-math></inline-formula> nanoparticles, particularly in the 50–100-nm range, significantly enhance luminosity while reducing phosphor usage in white LED manufacturing.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1877-1885"},"PeriodicalIF":3.0,"publicationDate":"2025-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design 利用物理信息理性Szegö内核进行微波设计的频谱贝叶斯优化

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-24 DOI: 10.1109/TCPMT.2025.3592441

Yens Lindemans;Thijs Ullrick;Ivo Couckuyt;Tim Pattyn;Dirk Deschrijver;Dries Vande Ginste;Tom Dhaene

{"title":"Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design","authors":"Yens Lindemans;Thijs Ullrick;Ivo Couckuyt;Tim Pattyn;Dirk Deschrijver;Dries Vande Ginste;Tom Dhaene","doi":"10.1109/TCPMT.2025.3592441","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3592441","url":null,"abstract":"Microwave device design increasingly relies on surrogate modeling to accelerate optimization and reduce costly electromagnetic (EM) simulations. This article presents a spectral Bayesian optimization (SBO) framework leveraging a physics-informed Gaussian process (GP) with a rational complex-valued Szegö kernel and input warping to enhance surrogate accuracy and data efficiency. Unlike conventional methods that model scalar objectives, our approach directly learns the complex-valued frequency response, enforcing causality and Hermitian symmetry. Effectiveness is demonstrated in two cases: a zig-zag microstrip bandpass filter optimized for magnitude response and a passive differential equalizer optimized for both transmission magnitude and group delay. By embedding prior physics and modeling directly in the frequency domain, the method enables accurate, sample-efficient optimization of frequency-dependent behavior. This work shows how physics-informed Bayesian optimization (BO) can significantly improve microwave device design efficiency.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1836-1846"},"PeriodicalIF":3.0,"publicationDate":"2025-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Signal-Integrity-Aware ILP Routing for Practical 2.5-D Chiplet Interconnects 实用2.5维芯片互连的信号完整性感知ILP路由

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-22 DOI: 10.1109/TCPMT.2025.3591501

Yunhui Li;Lihao Liu;Hongwei Xu;Han Diao;Li Shang;Cheng Yang;Zhicheng Ding;Fan Yang

{"title":"Signal-Integrity-Aware ILP Routing for Practical 2.5-D Chiplet Interconnects","authors":"Yunhui Li;Lihao Liu;Hongwei Xu;Han Diao;Li Shang;Cheng Yang;Zhicheng Ding;Fan Yang","doi":"10.1109/TCPMT.2025.3591501","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3591501","url":null,"abstract":"Chiplet-based designs using 2.5-D advanced packaging offer advantages in cost and flexibility over monolithic system-on-chip (SoC), enabling heterogeneous integration. However, the high interconnect density and stringent signaling requirements, particularly under standards like the Universal Chiplet Interconnect Express (UCIe), present significant routing challenges. Traditional routing methods often struggle with the unique constraints and high escape densities of 2.5-D interposers. This article proposes a signal-integrity (SI)-aware integer linear programming (ILP)-based routing method, specifically tailored for 2.5-D heterogeneous chiplet interconnects adhering to the UCIe standard. Our approach features an ILP formulation for simultaneous escape routing (SER) that integrates layer and track assignment while explicitly optimizing for minimal detours and bends to reduce insertion loss, and incorporating a coupling length constraint to directly mitigate crosstalk. A subsequent area routing stage connects the escape points, ensuring design rule compliance. The experimental results on UCIe-compliant benchmarks demonstrate the effectiveness of our method compared to both an open-source router and a commercial router. Our method not only achieves significant improvements in geometric quality, but also exhibits superior SI, validated through voltage transfer function (VTF) analysis. The proposed method provides an efficient, high-quality solution for routing practical 2.5-D chiplet systems.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1890-1901"},"PeriodicalIF":3.0,"publicationDate":"2025-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100490","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Reconfigurable Bandpass Filter Based on Novel Planar Integrated Switchable and Tunable Resonator With Improved Insertion Loss and Frequency Range 一种基于新型平面集成可切换可调谐谐振腔的可重构带通滤波器，具有改进的插入损耗和频率范围

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-21 DOI: 10.1109/TCPMT.2025.3590724

Jin Luo;Qianyin Xiang;Quanyuan Feng

引用次数: 0

A Flexible RF Link Enabled by the Redefinable Microwave Passive Components 可重定义微波无源元件实现的柔性射频链路

IF 3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-07-21 DOI: 10.1109/TCPMT.2025.3591150

Lei Sang;Hui Tian;Wenlong Bi;Shengjie Zhao;Ping Li;Qiang Chen;Hao Tu

{"title":"A Flexible RF Link Enabled by the Redefinable Microwave Passive Components","authors":"Lei Sang;Hui Tian;Wenlong Bi;Shengjie Zhao;Ping Li;Qiang Chen;Hao Tu","doi":"10.1109/TCPMT.2025.3591150","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3591150","url":null,"abstract":"To realize “FPGA-like” microwave components and enhance the reconfiguration ability of microwave links, this article proposes a redefinable microwave component that breaks the limitations of conventional microwave components with single functionality. The redefinable microwave components adopt a “combining tangram” design approach to identify the “greatest common divisor” among several microwave functional structures. The patch + gap structure is used as the multiplex unit, and the RF switches are used to control the current flow direction, forming different electromagnetic distributions, thus achieving dynamic reconfiguration of microwave functions. The resonant performance is adjusted using variable capacitors, enabling the reconfiguration of the performance. The test results of the sample indicate that the microwave passive component can achieve software-defined antenna, filtering, and coupling functions, with adjustable center frequencies for all three functions. Compared with commonly used antenna, filter, or coupler, the performance metrics of the redefinable microwave components have not decreased. Furthermore, the component has also been applied for practical validation in radar systems. The demonstration results show that the redefinable microwave component significantly improves the reconfiguration performance of the microwave link, enabling the microwave system to meet the requirements of multiple application scenarios such as imaging, communication, and distance measurement.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1973-1985"},"PeriodicalIF":3.0,"publicationDate":"2025-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145100382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0