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2025 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 15 2025索引IEEE组件，封装和制造技术交易卷15
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-02-12 DOI: 10.1109/TCPMT.2026.3664132
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-02-03 DOI: 10.1109/TCPMT.2026.3657089
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-02-03 DOI: 10.1109/TCPMT.2026.3657087
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-01-20 DOI: 10.1109/TCPMT.2026.3652066
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-01-20 DOI: 10.1109/TCPMT.2026.3652068
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-01-12 DOI: 10.1109/TCPMT.2025.3640548
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2026-01-12 DOI: 10.1109/TCPMT.2025.3640546
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引用次数: 0
Corrections to “Stable HIPPO-Based Circuit Macro-Modeling” 对“基于稳定hippo的电路宏观建模”的修正
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-11-24 DOI: 10.1109/TCPMT.2025.3614737
Bijan Shahriari;Roni Khazaka
{"title":"Corrections to “Stable HIPPO-Based Circuit Macro-Modeling”","authors":"Bijan Shahriari;Roni Khazaka","doi":"10.1109/TCPMT.2025.3614737","DOIUrl":"https://doi.org/10.1109/TCPMT.2025.3614737","url":null,"abstract":"In [1], typos are present in (6), (26), and (28). The correct equations are, respectively, presented as follows: begin{align*} g(r) approx k_0(t)p_0(r) + {dots }+ k_{mathcal N-1}(t)p_{mathcal N-1}(r). tag {6}end{align*} begin{align*} & dot V(mathbb Z) = left ({{ 2mathbb Z^{top } mathbf P + 2cmathbb {F}(mathbb Z)^{top }mathbf {Omega }}}right) left ({{-mathbb {Z} + Gamma mathbb {WF}(mathbb Z) }}right) & = begin{bmatrix} mathbb Z mathbb {F} end{bmatrix}^{top } & begin{bmatrix} -2mathbf P {& } mathbf PGamma mathbb W - cmathbf {Omega } mathbb W^{top } Gamma ^ {top }mathbf P - cmathbf {Omega }{& } left ({{mathbf {Omega }Gamma mathbb W + mathbb W^{top }Gamma ^ {top }mathbf {Omega }}}right)c end{bmatrix} begin{bmatrix} mathbb Z mathbb {F} end{bmatrix}. tag {26}end{align*} begin{align*} & mathbb H & = begin{bmatrix} -2mathbf P {& } mathbf PGamma mathbb W mathbb W^{top } Gamma ^ {top }mathbf P {& } left [{{mathbf {Omega }left ({{Gamma mathbb W - mathbf I}}right) + left ({{mathbb W^{top } Gamma ^ {top } - mathbf I}}right)mathbf {Omega }}}right]c end{bmatrix}. tag {28}end{align*}","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 11","pages":"2546-2546"},"PeriodicalIF":3.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11264839","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145584689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-11-24 DOI: 10.1109/TCPMT.2025.3626875
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-11-24 DOI: 10.1109/TCPMT.2025.3626873
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引用次数: 0
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