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Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2 前言：电力电子封装的多物理场方面的特别部分-功率芯片，功率模块和转换器水平：第2部分
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3505652
Przemyslaw Gromala;Fang Luo;Sreekant Narumanchi
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引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3511828
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3511828","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3511828","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"C4-C4"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10823083","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142925437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Access Publishing IEEE开放获取出版
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3521166
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TCPMT.2024.3521166","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3521166","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2144-2144"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10821526","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! techxiv：与世界分享你的预印本研究！
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-03 DOI: 10.1109/TCPMT.2024.3521164
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TCPMT.2024.3521164","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3521164","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2143-2143"},"PeriodicalIF":2.3,"publicationDate":"2025-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10821528","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Toward TSV-Compatible Microfluidic Cooling for 3D ICs 兼容tsv的3D集成电路微流控冷却研究
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-12 DOI: 10.1109/TCPMT.2024.3516653
Geyu Yan;Euichul Chung;Erik Masselink;Shane Oh;Muneeb Zia;Bharath Ramakrishnan;Vaidehi Oruganti;Husam Alissa;Christian Belady;Yunhyeok Im;Yogendra Joshi;Muhannad S. Bakir
{"title":"Toward TSV-Compatible Microfluidic Cooling for 3D ICs","authors":"Geyu Yan;Euichul Chung;Erik Masselink;Shane Oh;Muneeb Zia;Bharath Ramakrishnan;Vaidehi Oruganti;Husam Alissa;Christian Belady;Yunhyeok Im;Yogendra Joshi;Muhannad S. Bakir","doi":"10.1109/TCPMT.2024.3516653","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3516653","url":null,"abstract":"Cooling presents a significant challenge for high-performance 3-D integrated circuits (3D ICs). To this end, this research explores through-silicon via (TSV)-compatible micropin-fin heat sink (MPFHS) for high-power 3-D chip stacks. Copper TSVs with a diameter of <inline-formula> <tex-math>$5.2~mu $ </tex-math></inline-formula>m and a high aspect ratio (HAR) of 29:1 are developed. An extensive experimental and computational investigation of the MPFHS under varying flow rates and power conditions was conducted, showing that the MPFHS maintains an average chip temperature below <inline-formula> <tex-math>$72~^{circ }$ </tex-math></inline-formula>C, even with a total power dissipation of 500 W and a power density of 312 W/cm2 at a flow rate of 117 mL/min. The minimum total thermal resistance achieved was <inline-formula> <tex-math>$0.286~^{circ }$ </tex-math></inline-formula>C<inline-formula> <tex-math>$cdot $ </tex-math></inline-formula>cm2/W.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"104-112"},"PeriodicalIF":2.3,"publicationDate":"2024-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dynamic IGBT Compact Thermal Network Model Over Long Time Scales 长时间尺度的动态IGBT紧凑型热网模型
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-09 DOI: 10.1109/TCPMT.2024.3513323
Mingyao Ma;Qian Zhang;Weisheng Guo;Qiwei Song
{"title":"Dynamic IGBT Compact Thermal Network Model Over Long Time Scales","authors":"Mingyao Ma;Qian Zhang;Weisheng Guo;Qiwei Song","doi":"10.1109/TCPMT.2024.3513323","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3513323","url":null,"abstract":"The cause of failures in insulated gate bipolar transistor (IGBT) modules is primarily attributed to temperature-related factors. Accurately estimating the junction temperature of IGBT modules is crucial for enhancing their reliability. Currently, thermal network models stand as commonly used tools for estimating the junction temperature of IGBT modules. However, prevailing thermal models exhibit certain limitations in accurately predicting the junction temperature, particularly when considering the degradation of chip solder within IGBT modules. This article presents a practical degradation model of the chip solder layer, establishing a functional correlation between the chip solder degradation rate and the number of power cycles. A dynamic compact thermal network model over long time scales is established, and the method for thermal parameter extraction is discussed. The finite-element simulation and experimental results show that the dynamic compact thermal network model can accurately estimate the junction temperature.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"123-130"},"PeriodicalIF":2.3,"publicationDate":"2024-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142993691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information IEEE元件、封装与制造技术学会汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI: 10.1109/TCPMT.2024.3500721
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information","authors":"","doi":"10.1109/TCPMT.2024.3500721","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3500721","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"C4-C4"},"PeriodicalIF":2.3,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10778119","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142789051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Noncontact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects 通过电感耦合互连实现光子集成电路和电子集成电路的非接触集成
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI: 10.1109/TCPMT.2024.3511042
Tongchuan Ma;Liyiming Yang;Yanlu Li;Yuan Du
{"title":"Noncontact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects","authors":"Tongchuan Ma;Liyiming Yang;Yanlu Li;Yuan Du","doi":"10.1109/TCPMT.2024.3511042","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3511042","url":null,"abstract":"This letter presents an innovative noncontact packaging technique for photonic integrated circuits (PICs) and electronic integrated circuits (EICs) through inductively coupled interconnects. The primary aim of this approach is to enhance thermal isolation between the heat-generating electrical logic die and the thermally sensitive optical interferometer die. The feasibility of this contactless transceiver, which fulfills information transmission from the laser Doppler vibrometry (LDV) to the EIC, is substantiated via electromagnetic simulations. Furthermore, thermal simulations conducted by COMSOL prove that this packaging configuration could potentially reduce the temperature of PICs by up to <inline-formula> <tex-math>$4.6~^{circ }$ </tex-math></inline-formula>C when compared to the conventional 3-D stack packaging, underlining its potential for improved thermal performance.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"232-234"},"PeriodicalIF":2.3,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142992901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE元件、封装与制造技术资讯汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI: 10.1109/TCPMT.2024.3500719
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors","authors":"","doi":"10.1109/TCPMT.2024.3500719","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3500719","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10778114","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142789136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information IEEE元件、包装与制造技术汇刊信息
IF 2.3 3区 工程技术
IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI: 10.1109/TCPMT.2024.3500715
{"title":"IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information","authors":"","doi":"10.1109/TCPMT.2024.3500715","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3500715","url":null,"abstract":"","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2024-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10778162","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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