一种基于新型平面集成可切换可调谐谐振腔的可重构带通滤波器,具有改进的插入损耗和频率范围

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jin Luo;Qianyin Xiang;Quanyuan Feng
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引用次数: 0

摘要

研究了一种新型平面集成开关可调谐谐振器的空载质量因子($Q_{\text {u}}$)与谐振频率可调谐范围之间的权衡。基于变容二极管和p-i-n二极管负载的四分之一波长浮带谐振腔,设计了一种新型可切换可调谐谐振腔,并对谐振频率的连续可切换调谐特性进行了建模和研究。基于改进的Q_{\text {u}}$谐振腔,设计、制作并测量了频率连续可调、带宽稳定的可重构带通滤波器(BPF)。该元件的调谐范围为1.05-2 GHz,典型带宽为124 MHz,最小插入损耗(IL)为1.8 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Reconfigurable Bandpass Filter Based on Novel Planar Integrated Switchable and Tunable Resonator With Improved Insertion Loss and Frequency Range
The tradeoff between the unloaded quality factor ( $Q_{\text {u}}$ ) and resonant frequency tunable range of a novel planar integrated switchable and tunable resonator is studied. The novel switchable and tunable resonators are designed based on a quarter-wavelength resonator with a floating strip loaded by a varactor diode and p-i-n diode, and the continuously switchable tuning characteristics of the resonant frequency are modeled and investigated. A reconfigurable bandpass filter (BPF) with continuously tunable frequency and stable bandwidth based on the switchable and tunable resonator with improved $Q_{\text {u}}$ is designed, fabricated, and measured. The developed component demonstrates a tuning range of 1.05–2 GHz with a typical bandwidth of 124 MHz and a minimum insertion loss (IL) of 1.8 dB.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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