IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第10页

IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information 电气和电子工程师学会《部件、封装和制造技术》期刊出版信息

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3484219

引用次数: 0

Optimization of the Power/Ground Ball Map in 3-D-IC BGA Packages With Multiple Power Domains Using Deep Reinforcement Learning 基于深度强化学习的多功率域三维集成电路BGA封装功率/滚地球图优化

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-29 DOI: 10.1109/TCPMT.2024.3487577

Seunghun Ryu;Dongryul Park;Hyunwoong Kim;Seonghi Lee;Sanguk Lee;Hyunwoo Kim;Seongho Woo;Seokbeom Yong;Sangsub Song;Seungyoung Ahn

{"title":"Optimization of the Power/Ground Ball Map in 3-D-IC BGA Packages With Multiple Power Domains Using Deep Reinforcement Learning","authors":"Seunghun Ryu;Dongryul Park;Hyunwoong Kim;Seonghi Lee;Sanguk Lee;Hyunwoo Kim;Seongho Woo;Seokbeom Yong;Sangsub Song;Seungyoung Ahn","doi":"10.1109/TCPMT.2024.3487577","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3487577","url":null,"abstract":"In this article, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3-D-integrated circuits (ICs) considering multiple-power-domain (MPD) environments is proposed. With the adoption of the MPD in 3-D-ICs, the BGA in the package substrate, which routes the power and ground to the appropriate power domain and components from the board, faces design challenges such as highly complex power noise between the domains and allocations considering multiple power densities. To address this design complexity, a U-net-based DRL method is adopted, which trains an optimal policy to obtain an optimal power/ground ball map to mitigate simultaneous switching noise (SSN). The U-net enables the conservation of semantic and spatial information simultaneously, allowing the proposed method to optimize the complex ball map effectively within the BGA package for MPD. Furthermore, the proposed method shows reusability and scalability by training with variously displaced current source center (CSC) balls and various ball map sizes while maintaining the power grouping design. The optimality performance of the proposed method is verified by comparing it to conventional optimization algorithms such as random search (RS) and a genetic algorithm (GA). The proposed method outperforms RS and GA in terms of execution time and optimality performance across various tests with different ball map sizes and CSC positions.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"1943-1958"},"PeriodicalIF":2.3,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Failure Analysis on Abnormal Cracking of Flip-Chip Au Bumps During the High Temperature and Humidity Testing 高温高湿测试中倒装芯片金凸块异常裂纹的故障分析

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-29 DOI: 10.1109/TCPMT.2024.3487639

Yi Zhong;Zhongliang Liu;Binbin Jiang;Dongxiao Yang;Weidong Zhong;Penghui Wu;Tengteng He

{"title":"Failure Analysis on Abnormal Cracking of Flip-Chip Au Bumps During the High Temperature and Humidity Testing","authors":"Yi Zhong;Zhongliang Liu;Binbin Jiang;Dongxiao Yang;Weidong Zhong;Penghui Wu;Tengteng He","doi":"10.1109/TCPMT.2024.3487639","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3487639","url":null,"abstract":"Fine-pitch flip-chip Au bumps play a critical role in interconnecting and packaging advanced optoelectronics, historically known for their good corrosion resistance and high reliability. However, this study reveals the susceptibility of Au bumps to corrosion and cracking during <inline-formula> <tex-math>$85~^{circ }$ </tex-math></inline-formula> C/85%RH high temperature and humidity (THT) reliability testing. Cracks were observed at the under bump metallization (UBM) interfaces, originating at the bump undercut and propagating toward the bump center. This leads to a dramatic 26.7% reduction in mechanical shear strength, significantly compromising the reliability. The failure mechanism of Au bump was analyzed through the combination of characterization and simulation, which identifies a stress-induced and halogen-enhanced galvanic cell corrosion at the UBM interfaces as the root cause. Furthermore, a protective surface coating strategy involving self-assembled monolayer (SAM) notably improves bump corrosion resistance, as demonstrated by the absence of strength degradation and interfacial delamination after a 500-h accelerated THT test. These insights are pivotal for advancing reliable, high-performance optoelectronic packaging.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"506-511"},"PeriodicalIF":2.3,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Metalized 3-D Printed Plastic Resonator Demonstrating Superconductivity Below 4 K 金属化3d打印塑料谐振器显示4 K以下的超导性

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-28 DOI: 10.1109/TCPMT.2024.3487264

J. Bourhill;G. Cochet;J. Haumant;V. Vlaminck;A. Manchec;M. E. Tobar;V. Castel

引用次数: 0

Accelerated Induction Heating and Fast Bonding of Microchips Based on a Design of Hollow Magnetic Flux Concentrator 基于空心磁通集中器设计的微芯片加速感应加热与快速键合

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-23 DOI: 10.1109/TCPMT.2024.3484997

Shudian Wang;Bin Xie;Zhoulong Xu;Hao Wu

{"title":"Accelerated Induction Heating and Fast Bonding of Microchips Based on a Design of Hollow Magnetic Flux Concentrator","authors":"Shudian Wang;Bin Xie;Zhoulong Xu;Hao Wu","doi":"10.1109/TCPMT.2024.3484997","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3484997","url":null,"abstract":"As micro-electro-mechanical system (MEMS) technology advances and system-in-package (SIP) finds widespread use, the on-chip integration of heterogeneous devices has emerged as a key research focus. Induction heating, which implements the electromagnetic influence effect to convert electricity into heat, is expected to tackle this challenge. However, the unavoidable magnetic dispersion effect renders it difficult for raising magnetic field density in a small area, thus limiting the application of induction heating. In this work, we proposed a conical hollow magnetic flux concentrator (HMFC) by integrating soft magnetic particles with a polymer matrix, which demonstrates the superior capability of magnetic field focusing. The results show that the maximum heating temperature in 15 s was enhanced by 161.2% compared with the induction heating method without the concentrator, successfully reflowing Sn96.5Ag3.5Cu0.5 (SAC305) solder paste on \u0000<inline-formula> <tex-math>$300times 300times 20~mu $ </tex-math></inline-formula>\u0000m immersion gold copper pads. Compared with the reflow soldering method, the HMFC-focused induction heating enhanced the bonding strength of 0402-type chips by 18.1% with improved consistency. Besides, we demonstrate the potential of this chip-bonding solution for curved electronics manufacturing. With these fast and reliable bonding characteristics, the as-proposed HMFC-assisted focused induction heating method is a promising strategy for the effective bonding of microchips.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"1931-1935"},"PeriodicalIF":2.3,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study of Microdirectional Cu–W Contact Separation Stage Based on Multiphysics Coupling 基于多物理场耦合的微定向Cu-W接触分离级研究

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-23 DOI: 10.1109/TCPMT.2024.3485102

Ying Han;Hexing Li;Qiqi Gao

{"title":"Study of Microdirectional Cu–W Contact Separation Stage Based on Multiphysics Coupling","authors":"Ying Han;Hexing Li;Qiqi Gao","doi":"10.1109/TCPMT.2024.3485102","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3485102","url":null,"abstract":"The failure of welding of contact materials is a key factor restricting the improvement of electrical life and reliability of high-power electric contact switch electrical appliances. To study the melting deformation of microscopic contact area during the formation of contact static fusion welding, a new Cu-W composite contact with a 3-D quadrilateral, hexagonal, and rhombic dodecahedral microdirectional skeleton structure is designed. Based on the theory of fluid dynamics, the dynamic formation process of the molten metal bridge in the contact separation stage is numerically simulated; the temperature distribution, contact resistance size, and shape change of the contact surface are analyzed, and the size of the molten pool formed in the contact separation stage of the studied composites with different skeleton structures is calculated. The results show that the highest temperature of the Cu-W composite contacts with microdirectional skeleton structure occurs in the electrical contact position during the formation of molten metal bridge, among which the contact surface temperature of the composites with the rhombic dodecahedral skeleton structure is the lowest, and the contact resistance, liquid bridge deformation, and molten pool volume are the smallest. Both simulation and experiment show that the micro-oriented W skeleton structure can reduce the contact resistance between contacts, thereby reducing the temperature between contacts, reducing the range of erosion of Cu-W composite material contacts, and enhancing the anti-static welding performance, which has reference significance for the design of low-voltage electrical appliances.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2271-2279"},"PeriodicalIF":2.3,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fabrication and Formation Principle of Porous Cu–Sn Bumps for Metal Bonding in Chiplet Integration 微晶片集成中金属键合用多孔Cu-Sn凸点的制备及形成原理

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-23 DOI: 10.1109/TCPMT.2024.3485112

Zilin Wang;Ziqing Wang;Yunfan Shi;Qian Wang;Zheyao Wang

引用次数: 0

Optimized Liquid Impinging Jet Arrays for Cooling CPU Packages

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-23 DOI: 10.1109/TCPMT.2024.3485478

J. W. Elliott;A. J. Robinson

{"title":"Optimized Liquid Impinging Jet Arrays for Cooling CPU Packages","authors":"J. W. Elliott;A. J. Robinson","doi":"10.1109/TCPMT.2024.3485478","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3485478","url":null,"abstract":"This study investigates optimization of the thermal-hydraulic performance of liquid impinging jet arrays for cooling of concentrated heat sources with an integrated heat spreader (IHS), mimicking a typical high-powered CPU package. Three heat source sizes were investigated, namely <inline-formula> <tex-math>$10times 10$ </tex-math></inline-formula> mm2, <inline-formula> <tex-math>$15times 15$ </tex-math></inline-formula> mm2, and <inline-formula> <tex-math>$20times 20$ </tex-math></inline-formula> mm2, all with a 1.3 mm thick copper heat spreader. An automated optimization workflow was developed in a computational fluid dynamics (CFD)-based environment to determine the ideal geometric design parameters of the impinging jet array heat exchangers, with the objective functions chosen to minimize hydraulic power consumption and/or minimize the overall thermal resistance, representing both single and multiobjective optimization strategies. The analysis showed that for maximizing the heat transfer performance only, the design tended to favor fewer closely spaced and higher velocity jets that targeted a concentrated region within the footprint on the heat spreader that was commensurate with the heat source. This focused the high convective intensity of the impinging jets on the central region of the heat spreader where the highest heat flux levels exist. However, the high jet velocities incurred a comparatively high hydraulic pumping power penalty. Conversely, when minimizing both thermal resistance and hydraulic power consumption simultaneously, the design favored a much higher population of lower velocity jets in order to mitigate the pressure drop and reduce the hydraulic power. Here, despite the lower convective cooling intensity of the lower velocity jets, the designs leveraged a much larger surface area of the heat spreader, which tended to maintain high heat transfer performance with disproportionately lower hydraulic penalties.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"488-505"},"PeriodicalIF":2.3,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10731867","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Compact Multilayer SIW Bandpass Filter With Cross Coupling and Source-to-Multiresonator Coupling 具有交叉耦合和源-多腔耦合的紧凑型多层SIW带通滤波器

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-23 DOI: 10.1109/TCPMT.2024.3485081

Lu Qiu;Xiao-Wei Zhu;Xian-Long Yang

{"title":"Compact Multilayer SIW Bandpass Filter With Cross Coupling and Source-to-Multiresonator Coupling","authors":"Lu Qiu;Xiao-Wei Zhu;Xian-Long Yang","doi":"10.1109/TCPMT.2024.3485081","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3485081","url":null,"abstract":"In this article, a compact high-selectivity multilayer substrate integrated waveguide (SIW) filter bound by prepreg is proposed. The filter employs two quarter-mode SIW (QMSIW) cavities in the upper layers and a full-mode SIW cavity in the lower layers. By integrating the prepreg into the cavity, the filter can be mounted directly without screws, providing better integration for high-frequency filters and preventing the introduction of spurious signals by prepreg near the passband. The utilizing of QMSIW cavities can simultaneously introduce the cross coupling and source-to-multiresonator coupling, realizing a pair of transmission zeros (TZs) in the third-order filter. Additionally, it circumvents the design limitations of non-through vias imposed by printed circuit board (PCB) layout punching requirements. The measured center frequency of the filter is 24.64 GHz, with a minimum insertion loss of 1.20 dB and a return loss better than 16.70 dB. A pair of independent controllable TZs are located at 22.27 and 27.87 GHz, respectively. The proposed filter exhibits high selectivity, compactness, improved integration, and ease of manufacturing.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2331-2338"},"PeriodicalIF":2.3,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142918166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Compact Waveguide Filtering Power Dividers With Flexible Division Ratio and Enhanced Selectivity 具有灵活分割比和增强选择性的紧凑型波导滤波功率分压器

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-21 DOI: 10.1109/TCPMT.2024.3483773

Ya-Hui Zhu;Wei Qin;Jian-Xin Chen

{"title":"Compact Waveguide Filtering Power Dividers With Flexible Division Ratio and Enhanced Selectivity","authors":"Ya-Hui Zhu;Wei Qin;Jian-Xin Chen","doi":"10.1109/TCPMT.2024.3483773","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3483773","url":null,"abstract":"This article proposes a novel design approach for multiport waveguide (WG) filtering power dividers (FPDs) with compact size and enhanced selectivity. A modified cascade trisection (CT) as a basic building block is first investigated allowing for more transmission zeros (TZs) with reduced resonators. Then, the implementation method is given and a bandpass filter (BPF) is designed, where the three poles within the passband are contributed by two rectangular WG (RWG) resonators and a half-wavelength coupling slot connecting them. The coupling slot not only acts as a resonant node but also easily provides intercavity cross-coupling. Besides, the stacked configuration combined with the input/output coaxial feeding scheme enables the enhancement of selectivity by the anticipated two TZs above the passband. An instructive design method for FPDs is proposed, in which the different power divisions mainly depend on the electric field distribution of the fundamental mode of the RWG. Finally, two three-way equal/unequal FPDs with the power division ratios of 1:1:1 and 1:2:1 are simulated, fabricated, and measured. Compared to the reported FPDs, the proposed work demonstrates good features, such as low insertion loss (IL), high selectivity, flexible division ratio, compact size, and high power-handling capability, simultaneously.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2043-2049"},"PeriodicalIF":2.3,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0