Composite Right-/Left-Handed Bandpass Filters With Enhanced Out-of-Band Rejection Using Slow Wave Metamaterial Structure

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-18 DOI:10.1109/TCPMT.2025.3552681

Bukun Xu;Yazi Cao;Bo Yuan;Yanzhu Qi;Shichang Chen;Peng Zhao;Gaofeng Wang

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引用次数: 0

Abstract

A compact and easy-to-fabricate metamaterial by virtue of multilayer slow wave structure is introduced to effectively enhance the out-of-band rejection of composite right-/left-handed (CRLH) bandpass filters (BPFs). An equivalent circuit model of this multilayer slow wave metamaterial structure is derived and discussed. Four BPFs are designed and fabricated using 3-D glass integrated passive device (IPD) technology. The first two BPFs consist only of novel CRLH resonator unit cells, and the last two BPFs are composed of multilayer slow wave metamaterial structures introduced with the same parameters as the first two BPFs. The electromagnetic field in the BPFs is redistributed due to the presence of this metamaterial structure, which can significantly improve the filter attenuation capability at high-frequency spurious. Through simulations and measurements, the two BPFs incorporating multilayer slow wave metamaterial structures enhance the out-of-band attenuation capability at the high-frequency end by nearly 3 and nearly 18 times compared to the first two BPFs.

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利用慢波超材料结构增强带外抑制的左/右复合带通滤波器

介绍了一种结构紧凑、易于制造的多层慢波结构超材料，可有效提高复合左/右带通滤波器的带外抑制性能。推导并讨论了这种多层慢波超材料结构的等效电路模型。采用三维玻璃集成无源器件（IPD）技术，设计并制作了四个bpf。前两个bpf仅由新型CRLH谐振腔单元组成，后两个bpf由引入与前两个bpf相同参数的多层慢波超材料结构组成。由于这种超材料结构的存在，bpf中的电磁场被重新分配，可以显著提高滤波器在高频杂散下的衰减能力。通过模拟和测量，与前两种bpf相比，采用多层慢波超材料结构的bpf在高频端的带外衰减能力分别提高了近3倍和近18倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.